WMSIC Electronic Components

PCF2129T/2,518 PCF2129T

ModelPCF2129T/2,518
PackageSO-16-300mil
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCF2129T / 2, 518
Type
NXP
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCF2129T/2,518
Electronic Component
1
Package
SO-16-300mil
Electronic Component
Real-Time Clock (RTC)
Electronic Component
1.096g
Electronic Component
1
Features
Gate; Power Management and Battery;;; Programmable Clock Output; Battery;; Output; and
Electronic Component
BM0257268277
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~4.2V
Operating Current
700nA
Interface Type
I2C;SPI
Crystal Oscillator Type
Built-in
Output
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCF2129T/2,518 产品概述

一、产品简介

PCF2129T/2,518 是恩智浦(NXP)推出的一款超低功耗实时时钟(RTC)芯片,采用 SO-16(300 mil)封装,工作电压范围宽(1.8V4.2V),工作温度覆盖工业级(-40℃+85℃)。芯片集成时钟与日历功能,并提供闹钟输出,适合需要长期精准计时与低功耗待机的嵌入式与便携式应用。

二、主要参数

  • 接口类型:I²C(两线串口),并兼容常用串行控制方式(可用于与主控通信)
  • 工作电压:1.8 V ~ 4.2 V
  • 工作电流/静态电流(Iq):典型 0.7 μA(700 nA),极低待机功耗,利于电池供电系统
  • 晶振:内部集成晶振,减少外部元件需求
  • 闹钟输出:带有闹钟/中断输出,可用于唤醒 MCU 或定时事件控制
  • 工作温度:-40 ℃ ~ +85 ℃(工业级)
  • 封装:SO-16,300 mil(宽度约 0.295" / 7.50 mm)
  • 品牌:NXP(恩智浦)

三、功能亮点

  • 超低功耗:典型静态电流仅 0.7 μA,适合对待机耗电敏感的电池供电设备;
  • 集成化高:内置晶振与完整时钟/日历功能(秒、分、时、日、月、年、闰年处理),减少外部器件和校准需求;
  • 可编程闹钟输出:支持按日、按周或单次闹钟事件,灵活驱动 MCU 中断或外部电路;
  • 宽电压与工业温度范围:适用移动终端、工业监控及仪表等多种场景;
  • 标准封装便于替换:SO-16 300 mil 兼容常见 PCB 布局,利于量产和维修。

四、典型应用

  • 可穿戴设备与便携仪器(要求超低待机功耗);
  • 数据记录仪、计量仪表与远程抄表(需要长期计时与闹钟唤醒);
  • 工业控制与楼宇自动化(工业温度级、可靠性要求高);
  • 通信设备与物联网终端(外部 MCU 唤醒管理)。

五、设计与使用建议

  • 电源管理:为保证最低噪声与稳定性,芯片电源端应加适当去耦电容;若系统采用备份电池,应考虑芯片在主电源断电时的备份工作模式;
  • 总线布局:I²C 总线需配置合适的上拉电阻,线长与阻抗控制利于稳定通信;
  • 闹钟应用:闹钟输出能直接唤醒低功耗 MCU,但建议在中断线和唤醒策略上做防抖与滤波设计;
  • PCB 布局:若外围仍需外接晶体或电容,器件尽量靠近芯片布局并提供完整的接地平面以降低干扰。

六、封装与采购提示

  • 封装:SO-16(300 mil),便于直插或贴片组装;
  • 型号识别:订购时请确认完整料号 PCF2129T/2,518 及对应的温度与备份选项;如需替代品或批量应用,可联系供应商获取器件数据手册与可靠性资料。

本概述基于芯片主要电气与功能参数,建议在产品设计前结合官方数据手册获取详细寄存器、时序、电气图及应用电路,以确保在目标应用中的正确配置与可靠性。

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