WMSIC Electronic Components

MCIMX6U6AVM08AC

ModelMCIMX6U6AVM08AC
Package624-MAPBGA(21x21)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP MCIMX6U6AVM08AC
Type
NXP
Minimum package
60 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MCIMX6U6AVM08AC
Electronic Component
1
Package
624-MAPBGA(21x21)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
4g
CPU
32 Bit
CPU
ARM Cortex-A
Electronic Component
1
Electronic Component
BM0264342718
Operating Temperature
40℃~+125℃
Operating Voltage
1.8V;2.8V;3.3V;2.5V
CPU
800MHz
Electronic Component
Electronic Component
Electronic Component
60

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCIMX6U6AVM08AC 产品概述

MCIMX6U6AVM08AC是恩智浦(NXP)推出的工业级高性能微处理器(MPU),基于ARM Cortex-A7内核架构,主打宽温适应、高集成度与外设兼容性,广泛适用于工业控制、物联网网关等 harsh 环境应用场景。

一、核心架构与性能表现

该芯片搭载ARM Cortex-A7单核处理器,最大主频可达800MHz,相比同等级Cortex-A5架构产品性能提升约20%。内置关键缓存与加速单元:

  • 32KB L1指令缓存 + 32KB L1数据缓存;
  • 128KB L2统一缓存(用户参数中128KB即指此配置);
  • NEON™ 多媒体加速协处理器(支持128位SIMD运算)与VFPv4浮点运算单元,可满足音视频处理、算法运算等需求。

架构兼容ARMv7-A指令集,支持Linux(如Yocto、Debian)、Android Things等系统,便于快速开发工业级应用程序。

二、封装与工作环境

1. 封装规格

采用624引脚MAPBGA(21×21mm) 封装,球间距0.8mm,符合工业级封装可靠性标准,支持无铅焊接工艺,可直接集成到高密度PCB设计中。

2. 温度范围

工作温度覆盖**-40℃至+125℃**(工业级宽温),存储温度为-55℃至+150℃,满足户外、车间等极端温度场景的长期稳定运行需求(高负载场景需辅助散热)。

三、关键外设与接口配置

该芯片集成丰富工业级外设,适配多数现场总线与传感器接口:

  • 内存接口:支持DDR3/LPDDR2内存,最大容量1GB,满足系统运行与数据缓存需求;
  • 通信接口:2路10/100M Ethernet(带MAC)、6路UART、4路SPI、4路I2C、2路CAN 2.0B(工业控制常用);
  • 人机交互:支持LCD控制器(最大分辨率1024×768)、电阻/电容触摸屏接口;
  • 模拟与控制:12位ADC(10通道)、16路PWM、看门狗定时器(WDT)、实时时钟(RTC);
  • 其他:USB 2.0 OTG、SD/MMC卡接口、100+通道GPIO。

四、典型应用场景

MCIMX6U6AVM08AC的宽温特性与工业级外设使其成为以下场景的理想选择:

  1. 工业控制:PLC、伺服电机控制器、分布式IO模块;
  2. 物联网网关:工业物联网(IIoT)边缘网关、数据采集终端;
  3. 智能HMI:工业触摸屏、车载显示终端(非汽车级认证);
  4. 安防监控:高清网络摄像机、智能门禁终端;
  5. 智能设备:智能电表、充电桩控制器、农业物联网传感器节点。

五、优势与可靠性

  • 宽温稳定:-40~125℃工业级温度范围,通过JEDEC可靠性测试;
  • 低功耗设计:支持多种睡眠/待机模式,待机电流低至μA级,适合电池供电设备;
  • 开发便捷:NXP提供完整SDK(含Linux BSP、驱动源码),缩短开发周期;
  • 高集成度:集成多数工业外设,减少外部芯片数量,降低BOM成本与PCB复杂度。

注意:该型号为工业级产品,不直接支持汽车级ASIL认证,汽车场景需选择对应汽车级后缀型号(如MCIMX6U6AVM08ACQ)。

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