Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
NISSHINBO NJM5532DD
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NISSHINBO NJM5532DD
- Type
- NISSHINBO
- Minimum package
- 2000 卷
Technical parameters
- Electronic Component
- NISSHINBO
- Electronic Component
- NJM5532DD
- Electronic Component
- 1
- Package
- DIP-8
- Electronic Component
- Operational Amplifier
- Electronic Component
- 1g
- Electronic Component
- 1
- Features
- Built-in
- Electronic Component
- BM0127555926
- Operating Temperature
- 20℃~+75℃
- Amplifier
- 2
- Output Current
- 38mA
- (SR)
- 8V/us
- Static Current(Iq)
- 9mA
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NJM5532DD 产品概述
一、产品介绍
NJM5532DD 是 NISSHINBO 旗下的一款双路运算放大器，具有卓越的性能和广泛的应用范围。它以其高达 8V/µs 的灵敏度和 10MHz 的带宽，在音频放大、信号处理以及各种控制系统中得到了广泛的使用。NJM5532DD 的设计采用 DIP-8 封装，在便于电路设计和集成的同时，也确保了高效的散热能力。该产品的低噪声和高电流增益特性使其在高保真音频设备中的应用尤为突出。
二、技术规格
- 封装类型：DIP-8
- 工作温度范围：-40°C 至 +85°C
- 增益带宽积：10MHz
- 响应时间：8V/µs
- 输入失调电压：典型值为200µV，最大值可达到 1mV
- 失调电流：200nA
- 功率供应电压：±15V（同时支持单电源和双电源供电）
- 功耗：典型值为 4.5mW（在 ±15V 的供电下）
三、性能特点
高增益和带宽：NJM5532DD 的增益带宽积为 10MHz，使其能够适用于高频信号处理，特别适合于音频频率范围内的信号放大和处理。
低噪声特性：该运算放大器的低输入失调电压和输入失调电流使其能够在低信噪比环境中稳定工作，确保了高保真音频输出。
宽电源范围：支持双电源和单电源的供电方式，为设计提供了更大的灵活性，使其适用于多种应用场景，如音频放大和信号调理等。
高输入阻抗：其高输入阻抗特性，有效减少了对前级电路和传感器的负载，提高了信号的稳定性和准确性。
良好的频率特性：适合高频信号处理，适用范围从音频设备到工业控制系统，提供了极好的通用性。
四、应用领域
NJM5532DD 运算放大器试用于多种场合，包括但不限于：
- 音频设备：高保真的音频放大器，以及家用音响、乐器音频处理器等。
- 信号处理：用于信号采集和处理系统，比如数据采集系统的前置放大和滤波。
- 工业控制系统：在工业自动化中，常用于传感器信号的放大和执行器的驱动。
- 医疗设备：在医疗监测仪器中，处理生物信号如心电图(ECG)、脑电图(EEG)等。
五、总结
NJM5532DD 是一款性能强大且灵活的双路运算放大器，凭借其高增益、较宽的带宽、低噪声及多样的应用场景，被广泛应用于音频和信号处理领域。其DIP-8封装不仅便于集成和布线，还满足了大多数用户的系统设计需求。选择 NJM5532DD 的电子工程师能够在提高系统性能的同时，享受到优质的音频和信号处理体验。无论是在科研项目、商业产品设计，还是个人DIY开发中，它都将是一个理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
