WMSIC Electronic Components

NISSHINBO RP114K181D-TRB

ModelRP114K181D-TRB
PackageDFN1010-4B
BrandNISSHINBO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NISSHINBO RP114K181D-TRB
Type
NISSHINBO
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
300mV@(300mA)
Electronic Component
NISSHINBO
Electronic Component
75uVrms
Electronic Component
RP114K181D-TRB
Electronic Component
1
Package
DFN1010-4B
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0231045246
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
5.25V
Output
Electronic Component
Output Voltage
1.8V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RP114K181D-TRB 产品概述

RP114K181D-TRB 是 NISSHINBO 提供的一款低压差线性稳压器(LDO),为需要稳定1.8V电源的便携与高性能系统提供高抑制比、低噪声和低静态电流的电源解决方案。器件采用小型 DFN1010-4B 封装,集成使能端和过流保护,适合空间受限且对电源质量有严格要求的应用。

一、主要规格一览

  • 输出类型:固定(1.8V)
  • 最大工作电压:5.25V
  • 输出电流:最大 300 mA
  • 压降(典型/最大):300 mV @ 300 mA
  • 电源纹波抑制比(PSRR):75 dB @ 1 kHz
  • 静态电流(Iq):50 μA(典型)
  • 输出噪声:75 μV RMS
  • 特性:带使能端(EN);内置过流保护(OCP)
  • 工作温度范围(Ta):-40 ℃ ~ +85 ℃
  • 输出极性:正输出
  • 输出通道数:1
  • 封装:DFN1010-4B(小型 4 引脚)

二、关键特性与设计优势

  • 高 PSRR(75 dB @1 kHz):在 1 kHz 周围对输入电源纹波抑制能力优异,适用于对电源纹波敏感的模拟/射频前端和基带电路,能显著降低电源干扰对系统性能的影响。
  • 低压差(300 mV @ 300 mA):在高负载情况下仍保持较小的压降,便于从 3.3V 或 2.8V 等常见电源轨获取稳定的 1.8V 输出,提升电源利用效率和电池续航。
  • 低静态电流(50 μA):适合电池供电与低功耗应用,空闲或待机模式下的静态消耗小,有助于延长电池寿命。
  • 低噪声(75 μV RMS):适合对噪声敏感的模拟电路、传感器、音频放大器和 ADC 供电,减少对测量精度与信噪比的影响。
  • 带使能端与过流保护:支持电源管理与上电序列控制,同时内置过流保护,增强系统可靠性并减少外部保护元件需求。

三、典型应用场景

  • 移动与便携设备的 1.8V 数模混合电路供电
  • 无线通信模块、RF 前端或基带 IC 的低噪声电源
  • 传感器、数据采集与 ADC/DAC 前端电源
  • 低功耗物联网(IoT)终端、可穿戴设备与电池供电系统
  • 摄像头模组、显示驱动或音频子系统的局部稳压

四、封装与 PCB 布局建议

  • 封装:DFN1010-4B,适合高密度 PCB 设计,尺寸小、热阻相对较大,需要通过 PCB 铜箔散热。
  • 布局建议:
    • 在输入(VIN)和输出(VOUT)引脚附近放置低 ESR 陶瓷电容以保证稳定性与瞬态响应;常见做法为 1 μF~4.7 μF 陶瓷电容(具体容量与 ESR 需参考器件稳定性要求)。
    • 将输入电容尽可能靠近 VIN 引脚放置,输出电容靠近 VOUT 引脚放置,地线采用短而低阻抗的回流路径。
    • 对于 DFN 封装建议在器件底部开一个暴露铜垫并焊接到大面积地铜以增强热散发能力。必要时在地层中布置过孔将热量引导到散热层或外部散热铜箔。
    • 使能(EN)引脚布线要短,避免噪声耦合;若不使用,按数据手册建议连接到适当电平以确保器件处于已知状态。

五、设计注意事项

  • 输出电容特性:LDO 的稳定性通常依赖输出电容的容量与等效串联电阻(ESR),选用低 ESR 的多层陶瓷电容可实现较好瞬态性能,但应验证器件在所选电容条件下的稳定性。
  • 启动与上电序列:利用 EN 管脚实现软启或开/关序列时,注意上电速率对输出过冲或瞬态的影响。
  • 保护特性:内置过流保护可在短路或过载时限制电流,仍需在系统层面评估过热与连续高功耗运行对温升的影响并设计相应热保护或散热方案。
  • 电源裕量:输入电压须大于输出电压加上压差(VOUT + VDROP)并低于最大工作电压 5.25V,以确保器件在所有工况下工作可靠。

六、订购与选型提示

  • 型号:RP114K181D-TRB(NISSHINBO)
  • 封装:DFN1010-4B,TRB 后缀通常表示带卷带封装(Tape & Reel),便于自动贴片生产。
  • 在最终设计前,建议参考厂方完整数据手册以获取精确的电气特性曲线、引脚定义、外部元件推荐及温升/热阻数据。

RP114K181D-TRB 以小尺寸、高 PSRR、低噪声与低静态电流的组合,适合对电源质量和功耗有严格要求的便携与通信类应用。按照推荐的布局与外部元件配置,可在系统中实现稳定可靠的 1.8V 电源输出。

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