Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
NISSHINBO NJM2902M-TE1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NISSHINBO NJM2902M-TE1
- Type
- NISSHINBO
- Minimum package
- 2000 卷
Technical parameters
- Electronic Component
- NISSHINBO
- Electronic Component
- NJM2902M-TE1
- Electronic Component
- 1
- Package
- DMP14
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.259g
- Electronic Component
- 1
- Electronic Component
- BM0209605668
- Operating Temperature
- 40℃~+85℃
- Amplifier
- 4
- Output Current
- 40mA
- (SR)
- 500V/ms
- Power Supply Voltage
- 3V~30V
- Static Current(Iq)
- 1mA
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NJM2902M-TE1 产品概述
产品简介
NJM2902M-TE1 是一款高性能双通道运算放大器，制造商为日本的 NISSHINBO。运算放大器是电子电路中非常重要的基础元件，广泛应用于信号处理、滤波器、放大器以及各种控制系统中。该产品以其卓越的性能、宽广的应用范围和优良的稳定性而受到电子工程师的广泛青睐。
主要特点
双通道设计：NJM2902M-TE1 包含两个运算放大器，可以在同一封装中提供双路信号处理能力，有助于减小电路板的面积并降低系统的复杂性。
低噪声特性：该运算放大器具有较低的输入噪声特性，能够在信号处理过程中有效降低噪声，使得其在精密测量及音频应用中表现出色。
宽电源电压范围：NJM2902M-TE1 支持宽广的电源电压（通常在 ±3V 至 ±15V 之间），适应多种电源需求，且在宽电压范围内提供稳定的性能。
高增益带宽积：该器件提供高增益带宽积，确保其在高频率信号处理中具有良好的性能，适合用于数据采集、电信和其他高频应用。
完整的短路保护：NJM2902M-TE1 设计中包含短路保护电路，当发生输出短路时，能够防止毁坏运算放大器，提升了设备的可靠性。
应用领域
NJM2902M-TE1 运算放大器可广泛应用于多个领域，主要包括：
音频设备：其低噪声和高线性度使得 NJM2902M-TE1 特别适合用于音频信号处理，如功率放大器、混音器和音频均衡器等设计中。
数据采集系统：高增益和宽带宽特性使得该器件非常适合用于信号采集系统，能够有效支持高速信号转换和处理。
仪器仪表：在医疗设备、测量仪器等领域，NJM2902M-TE1 被广泛应用于信号调理和放大，以确保测量的精度和稳定性。
通信系统：由于其宽频带特性，NJM2902M-TE1 被广泛应用于各类通信设备中，比如放大和处理 RF 信号等。
封装和引脚配置
NJM2902M-TE1 采用 DMP14 封装，这是一种常见的半导体封装类型，具有较好的散热性能和机械强度，非常适合在较为复杂的电路中使用。该封装结构紧凑，适合高集成度的电路设计。
在引脚配置方面，NJM2902M-TE1 的每个运算放大器都由输入引脚（反相和同相输入）、输出引脚和电源引脚组成。具体引脚定义通常可以在产品数据手册中找到，数据手册提供详尽的引脚排列和功能说明，能够帮助工程师在设计时轻松接入。
结论
NJM2902M-TE1 是一款具有高性能、低噪声、宽电源电压范围的双通道运算放大器，非常适合广泛的应用场景，包括音频处理、仪器仪表和数据采集系统等。其 DMP14 封装设计使得其在电路设计中更具便利性与可靠性，成为电子工程师在设计方案时的优选器件。选择 NJM2902M-TE1，不仅是对出色性能的选择，更是对产品质量与可靠性的保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
