Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
NISSHINBO NJG1157PCD-TE1
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NISSHINBO NJG1157PCD-TE1
- Type
- HFFP10-CD(2.5X2.5)
- Minimum package
- 3000 卷
Technical parameters
- IP3
- 3dBm
- P1dB
- 15dBm
- Electronic Component
- NISSHINBO
- Electronic Component
- NJG1157PCD-TE1
- Electronic Component
- 18.5dB
- Electronic Component
- 1
- Package
- HFFP10-CD(2.5x2.5)
- Electronic Component
- RFAmplifier
- Electronic Component
- 1g
- Electronic Component
- 1
- Electronic Component
- BM0004150763
- Noise Figure
- 1.7dB
- Operating Temperature
- 40℃~+105℃
- Operating Voltage
- 1.5V~3.3V
- Operating Current
- 3.3mA
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NJG1157PCD-TE1 产品概述
一、产品背景
NJG1157PCD-TE1 是一款高性能射频放大器IC，专为 GPS 应用设计，工作频率范围覆盖 1.575 GHz 到 1.602 GHz。该产品由日本 NISSHINBO 公司制造，采用 HFFP10 封装，具备优异的放大性能和低噪声特性，适用于高效能导航和定位系统。
二、产品特点
高增益和低噪声： NJG1157PCD-TE1 提供了卓越的增益性能，通常可达到 20 dB 以上，而其核心噪声系数低于 1.5 dB。这意味着在强信号和弱信号环境中能保持较高的信号质量，极大地提高了 GPS 系统的定位精度。
宽频带应用： 产品的工作频率范围涵盖了 GPS 常用的 L1 频段（1.575 GHz），并且能够支持相邻频段信号的放大，对于多频 GNSS（全球导航卫星系统）接收器的应用相当适用。
低功耗设计： NJG1157PCD-TE1 采用高效的功耗管理方案，典型的功耗小于 20 mW，使其非常适合移动设备和便携式应用场景。低功耗特性再结合小型 HFFP10 封装，使得此 IC 可以在功耗敏感的应用中表现出色。
高线性度： NJG1157PCD-TE1 的线性度非常高，能够有效抵抗外界干扰和非线性失真，确保在实际应用中无论信号强度如何，都能维持输出信号的质量。
良好的温度稳定性： 该 IC 设计时充分考虑了温度变化的影响，确保在 -40°C 到 +85°C 的环境下，仍能保持稳定的工作状态，满足各类恶劣条件下的应用需求。
三、应用场景
NJG1157PCD-TE1 已经被广泛应用于多个领域，主要包括：
- 智能手机：在移动设备中用作 GPS 定位模块，帮助用户在各种环境下获取精准的位置服务。
- 汽车导航：用于高端汽车导航系统中，提供稳定且高效的定位服务。
- 无人机及遥控飞行器：在无人机和遥控飞机等设备中，确保其在空中飞行时准确获取位置信息。
- 物联网设备：在IoT设备中，增强设备的定位功能，促进更智能的数据收集和处理。
四、技术规格
- 频率范围：1.575 GHz - 1.602 GHz
- 增益：≥ 20 dB
- 噪声系数：< 1.5 dB
- 功耗：< 20 mW
- 封装类型：HFFP10
- 工作温度范围：-40°C 到 +85°C
五、总结
NJG1157PCD-TE1 射频放大器IC 是一款设计精良、性能卓越的产品，专为 GPS 等导航系统的需求而研发。凭借其高增益、低噪声、低功耗和优秀的温度稳定性，该产品适用于各类先进的消费电子设备和移动应用。无论是对精确度要求高的定位服务，还是对功耗有严格控制的便携式设备，NJG1157PCD-TE1 都能够提供可靠且高效的解决方案，是开发人员实现创新和高效设计的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset for ATMEGA128-16AC
- Model
- ATMEGA128-16AC
- Package
- QFP-64
