WMSIC Electronic Components

OMRON B3SN-3012P B3SN

ModelB3SN-3012P
PackageSMD-4P,6x6mm
BrandOMRON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
OMRON B3SN-3012P
Type
OMRON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
OMRON
Electronic Component
B3SN-3012P
Electronic Component
1
Package
SMD-4P,6x6mm
Electronic Component
Switch
Electronic Component
0.334g
Electronic Component
1.6N
Electronic Component
1
Electronic Component
BM0209692309
Electronic Component
Electronic Component
Operating Temperature
25℃~+70℃
Switch
6mm
Switch
6.5mm
Switch
0.9mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

欧姆龙B3SN-3012P轻触开关产品概述

欧姆龙B3SN-3012P是一款专为小型化、高可靠性设备设计的SMD立贴轻触开关,凭借IP67防护等级、紧凑尺寸与稳定性能,广泛适配消费电子、医疗便携设备等场景,解决了紧凑空间内的可靠按键操作与潮湿/粉尘环境的防护痛点。

一、产品核心定位与场景适配

B3SN-3012P定位为小型防水轻触开关,核心解决两大需求:一是在0.5mm以下厚度的设备内部集成可靠按键,二是应对日常溅水、短时浸水等场景的防护。其设计兼顾操作手感与环境适应性,适合智能穿戴、便携医疗、户外手持终端等对尺寸、防护、稳定性有要求的设备,可有效抵御灰尘、溅水甚至1米水深浸泡30分钟的工况,延长设备使用寿命。

二、基础参数与结构解析

2.1 电路与操作参数

  • 电路结构:单刀单掷(SPST-NO),常态断开、按压导通,符合常规轻触开关的操作逻辑,适合信号控制场景;
  • 作用力:1.6N,介于轻触(1N左右)与中等力度(2N+)之间,按压反馈清晰,可降低误触概率,同时避免长时间操作疲劳;
  • 触点规格:50mA(直流)/12V,适配低功耗设备的信号传输(非大电流负载,需注意负载限制)。

2.2 尺寸与安装

  • 外形尺寸:长6.5mm×宽6mm×高0.9mm,属于超小型薄型设计,可轻松集成到超薄设备内部(如智能手环、蓝牙耳机);
  • 安装方式:立贴式SMD(表面贴装),4脚SMD接片引脚,适配自动化贴装产线,生产效率高且节省PCB空间;
  • 防护等级:IP67(防尘等级6:完全防止粉尘进入;防水等级7:1米水深浸泡30分钟无损坏),可应对日常洗手溅水、户外小雨等场景。

2.3 环境适应性

工作温度范围:-25℃至+70℃,覆盖大部分室内外使用场景(如冬季户外手持设备、夏季室内电子设备),满足常规环境下的稳定运行。

三、品牌与封装优势

作为欧姆龙旗下轻触开关系列产品,B3SN-3012P继承了品牌的可靠性基因:采用高精度触点结构,减少接触电阻波动,提升信号传输稳定性;封装为SMD-4P(6×6mm),符合国际通用贴装标准,兼容性强,可与主流电子设备的PCB设计无缝适配,无需额外定制。

四、性能特点与使用建议

4.1 核心优势

  1. 高防护性:IP67等级突破常规轻触开关的防护上限,适合潮湿、粉尘环境;
  2. 小型薄型:0.9mm高度适配超薄设备,满足智能穿戴等产品的“轻薄化”趋势;
  3. 操作舒适:1.6N适中作用力,兼顾反馈清晰度与操作疲劳度;
  4. 易集成:立贴SMD设计,无需螺丝固定,节省装配工序。

4.2 使用注意事项

  • 负载电流/电压需严格控制在额定值(≤50mA DC/12V),避免大电流导致触点烧蚀;
  • 贴装时遵循欧姆龙推荐的回流焊工艺参数(如峰值温度≤260℃),防止高温损坏内部结构;
  • 长期使用中避免频繁按压超过开关机械寿命(常规约10万次以上,需结合实际工况)。

五、典型应用领域

B3SN-3012P的特性使其适配多类场景:

  • 消费电子:智能手环、蓝牙耳机、小型遥控器、便携式音箱的功能按键;
  • 医疗设备:便携血糖仪、小型监护仪、雾化器的操作面板;
  • 工业控制:小型PLC控制面板、手持编程器的控制键;
  • 户外设备:手持GPS终端、便携气象仪、户外照明设备的开关。

总结:欧姆龙B3SN-3012P以“小型化+高防护+稳定性能”为核心,是紧凑设备中替代常规轻触开关的理想选择,尤其适合对环境适应性有要求的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.