Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
OMRON XF3M(1)-1015-1B XF3M
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- OMRON XF3M(1)-1015-1B
- Type
- SMD, P=1MM, HORIZONTAL
- Unit
- Electronic Component
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- OMRON
- Electronic Component
- XF3M(1)-1015-1B
- Electronic Component
- 1
- Package
- SMD, P=1mm
- Electronic Component
- FFC / FPC Connector
- Electronic Component
- 0.553g
- Electronic Component
- 1mm
- Electronic Component
- 1
- Electronic Component
- BM0217105477
- Electronic Component
- Electronic Component
- Operating Temperature
- 30℃~+85℃
- Electronic Component
- 2mm
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述: XF3M(1)-1015-1B FFC/FPC连接器
一、产品简介
XF3M(1)-1015-1B是一款由Omron Electronics Inc-EMC Division制造的高性能FFC/FPC连接器，专为现代电子设备的高密度布局而设计。凭借其优越的电气性能、耐用的材料和贴心的设计，这款连接器适用于各种消费电子产品、计算机、通讯设备等领域，能够有效保证信号稳定和可靠性。
二、主要参数
- 制造商: Omron Electronics Inc-EMC Div
- 系列: XF3M
- 包装: 卷带（TR）
- 零件状态: 有源
- 扁平柔性类型: FFC，单线
- 安装类型: 表面贴装，直角
- 连接器/触头类型: 双侧触点，上下接
- 针位数: 10
- 间距: 0.039"（1.00mm）
- 端接: 焊接
- FFC、FCB 厚度: 0.30mm
- 板上高度: 0.079"（2.00mm）
- 锁定功能: 旋转锁，背锁
- 电缆端类型: 锥形
- 触头材料: 铜合金
- 触头表面处理: 镀金
- 外壳材料: 不含卤素的液晶聚合物（LCP）
- 致动器材料: 不含卤素的液晶聚合物（LCP）
- 特性: 固定焊尾
- 额定电压: 50V
- 工作温度: -30°C ~ 85°C
- 材料可燃性等级: UL94 V-0
- 额定电流: 0.5A
- 触头表面处理厚度: 闪存
- 外壳颜色: 天然
- 致动器颜色: 黑色
- 配接次数: 20
三、产品特点
高密度连接: XF3M系列的连接器采用1.00mm的紧凑间距设计，能够在有限空间内实现高密度的电路连接，适合微型电子设备的需求。
可靠的电气性能: 额定电压50V和额定电流0.5A的设计可以支持多种信号传输需求，能够应对复杂的信号及电流要求。
耐温性强: 此连接器适于-30°C至85°C的工作环境，可广泛应用于各种气候条件下的设备中。
优质材料: 采用铜合金触头，经过镀金处理，确保优良的导电性能和抗氧化能力。同时，连接器外壳和致动器使用了不含卤素的液晶聚合物材料，符合环保标准，确保设备的长期可靠性。
牢固的连接: 旋转锁定功能设计，确保FFC/FPC连接器在使用过程中不会轻易松脱，保持连接的稳固性和安全性。
客户友好设计: 固定焊尾设计使得焊接更加简单，有助于提高生产效率，降低生产成本。
四、应用领域
XF3M(1)-1015-1B连接器广泛应用于以下领域：
- 消费电子: 如手机、平板电脑、智能手表等，满足高密度连接要求。
- 计算机及外设: 适用于主板、显卡及其他周边设备的高效连接。
- 通讯设备: 在无线通信、网络设备等领域，确保稳定的信号传输。
- 工业设备: 针对自动化设备、传感器等提供可靠连接。
五、总结
XF3M(1)-1015-1B FFC/FPC连接器代表了Omron在连接器领域的先进技术和严谨品质。其紧凑设计、优良的电气性能和耐用材料使其成为各种电子设备的理想选择。无论是在研发还是生产阶段，这款连接器都能为工程师提供卓越的支持，确保产品的可靠性和稳定性。随着科技的发展，XF3M系列连接器将继续引领FFC/FPC连接技术的进步，为智能化设备的不断创新奠定基础。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece ATMEGA328P-AU BGA Integrated Circuit Chipset QFP-32
- Model
- ATMEGA328P-AU
- Package
- DIP-28 / QFP-32
