WMSIC Electronic Components

OMRON XF2M-0815-1A XF2M

ModelXF2M-0815-1A
PackageSMD, P=0.5mm
BrandOMRON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
OMRON XF2M-0815-1A
Type
OMRON
Unit
Electronic Component
Minimum package
1500 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
OMRON
Electronic Component
XF2M-0815-1A
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.438g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0264923868
Electronic Component
Electronic Component
Operating Temperature
30℃~+85℃
Electronic Component
2.1mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
8P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

欧姆龙XF2M-0815-1A FPC连接器产品概述

一、产品核心定位

欧姆龙XF2M-0815-1A是一款0.5mm间距直角卧贴FPC连接器,专为空间受限、高密度连接场景设计,采用8位双侧触点结构,适配0.3mm厚柔性电缆,广泛应用于便携电子、小型医疗及工业控制领域,兼顾高可靠性与紧凑尺寸,是小间距设备内部信号/电源连接的优选方案。

二、基础参数与结构特性

2.1 核心参数梳理

类别 具体参数 触点规格 8P双侧触点(上下接)、0.5mm间距 安装方式 直角卧贴(R/A) 尺寸要求 板上高度2.1mm、适配FPC厚度0.3mm 触头材质 高弹性铜合金+镀金镀层 环境适应性 工作温度-30℃~+85℃

2.2 结构设计亮点

  • 双侧触点结构:触点同时接触FPC上下表面,接触力分布均匀,可减少FPC安装偏差导致的接触不良,提升连接稳定性;
  • 直角卧贴设计:无需额外垂直空间,可直接贴装于PCB表面,适配多种内部模块布局,降低布线复杂度;
  • 紧凑尺寸:2.1mm板高+0.5mm间距,满足超薄设备(如智能手表、便携医疗设备)的空间限制。

三、触头与镀层性能

3.1 触头材料优势

触头采用高导电铜合金,兼具良好的弹性与机械强度:

  • 可承受10次以上FPC压接/分离操作(常规FPC连接器压接次数),避免长期使用后触点变形或接触力下降;
  • 导电性能稳定,减少信号传输损耗,适合高频信号连接需求。

3.2 镀金镀层特性

触头表面镀金镀层厚度≥0.2μm(欧姆龙标准),具备三大优势:

  • 抗氧化抗腐蚀:在湿度较大(如医疗设备消毒环境)或轻微腐蚀性环境下,仍能保持稳定电气性能;
  • 低接触电阻:接触电阻≤50mΩ(典型值),减少信号衰减与功率损耗;
  • 耐磨擦性:降低FPC插拔过程中触头的磨损,延长产品使用寿命。

四、安装与使用注意事项

  1. 贴装工艺要求:
    采用回流焊贴装时,需遵循欧姆龙推荐温度曲线(峰值温度245℃±5℃,时间≤10秒),避免高温导致塑料壳体变形或触头镀层损坏;
  2. FPC适配规范:
    必须使用0.3mm厚、8P、0.5mm间距的FPC电缆,压接时需均匀用力(避免单侧受力),确保FPC焊盘与连接器触点精准对齐;
  3. 存储与防护:
    产品需存储于干燥阴凉环境(温度-40℃~+60℃,湿度≤60%),开封后建议3个月内使用完毕;贴装/使用过程中需采取ESD防护,防止静电损坏触头。

五、典型应用场景

  • 消费电子:智能手机、平板电脑的内部模块连接(如摄像头模组、按键板与主板);
  • 可穿戴设备:智能手表、手环的电池、传感器与主板的高密度连接;
  • 小型医疗设备:便携式血糖仪、血压计的内部电路模块连接;
  • 工业控制:小型PLC、传感器节点的紧凑式信号连接。

六、产品优势总结

  1. 尺寸紧凑:0.5mm间距+2.1mm板高,适配超薄设备空间限制;
  2. 连接可靠:双侧触点+镀金铜合金,接触电阻低、稳定性高;
  3. 宽温适用:-30℃~+85℃满足消费电子与工业场景的宽温需求;
  4. 安装灵活:直角卧贴设计,适配不同PCB布局;
  5. 品牌保障:欧姆龙品质管控,一致性与可靠性经市场验证。

该产品凭借紧凑尺寸、可靠性能与灵活安装,成为小间距FPC连接场景的成熟解决方案,可满足多种设备的高密度连接需求。

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