WMSIC Electronic Components

On-Bright OB2222ECPA

ModelOB2222ECPA
PackageSOP-8
BrandOn-Bright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
On-Bright OB2222ECPA
Type
ON-BRIGHT
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON-BRIGHT
Electronic Component
OB2222ECPA
Electronic Component
1
Package
SOP-8
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.169g
Electronic Component
1
Features
Audio;;; EMI Optimization; (OTP); (SCP); (CV); (UVP); (OVP)
Electronic Component
BM0264971734
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~6V
Switching Frequency
36kHz~44kHz
Isolation
Non-isolated
Output Voltage
5V
Output Current
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OB2222ECPA 产品概述

OB2222ECPA 是昂宝(On-Bright)推出的一款高性能、高精度、低成本的 PWM 功率开关器件,适用于非隔离降压(Buck)和降压-升压(Buck-Boost)小功率电源方案。器件将电流模式 PWM 控制器与高压功率双极晶体管集成在 SOP-8 封装中,内置多项保护与性能优化功能,适合便携类和低功耗应用中对体积、成本与电磁兼容(EMI)有较高要求的场景。

一、主要规格与功能特性

  • 是否隔离:非隔离
  • 输入/工作电压范围:4.5 V ~ 6 V
  • 输出电压:5 V(目标输出)
  • 输出电流:100 mA(典型)
  • 开关频率:36 kHz ~ 44 kHz(抖频以降低 EMI)
  • 最大占空比:15%
  • 内置功率晶体管耐压:700 V(器件级安全裕量)
  • 拓扑结构:降压(Buck)与降压-升压(Buck-Boost)兼容
  • 封装:SOP-8
  • 品牌:On-Bright(昂宝)

关键功能:

  • 轻载高效工作模式,提升低功率效率,延长电池寿命
  • 音频噪声抑制,适用于对声音敏感的便携设备
  • 欠压锁定(UVLO)与欠压保护(UVP)
  • 过压保护(OVP)与恒压控制(CV)
  • 短路保护(SCP)与过热保护(OTP)
  • 前沿消隐(Front-end blanking)减少开关尖峰误动作
  • EMI 优化(抖频/Spread Frequency)减低干扰峰值

二、器件优势与设计亮点

  • 高集成度:将 PWM 控制与高压功率晶体管集成,简化外围器件,缩小 PCB 面积与系统成本。
  • 优化的误差放大器:内部误差放大器针对过冲和动态响应进行了优化,有助于在负载变化时维持较好的稳态和瞬态性能。
  • 轻载节能:专门的轻载高效模式使得在低输出电流条件下仍能保持较高转换效率,适合待机与物联网终端场景。
  • EMI 友好:工作频率采用抖频处理,降低单一频点的能量集中,便于系统满足 EMI 测试要求。
  • 多重保护:综合了 UVP、OVP、SCP、OTP 等保护机制,提升系统可靠性,降低整机出现故障的风险。

三、典型应用场景

  • 便携式终端与移动电源子模块:为 MCU、传感器、通信模块提供稳压 5 V 电源(低于 1 W 的场合)。
  • 低功耗物联网设备与智能传感器节点:在轻载工作条件下保持高效率,延长电池寿命。
  • 小功率 LED 驱动与指示电源:需要恒压输出并具备短路及过温保护的应用。
  • 工业控制与仪器小电源:体积受限、需多重保护与良好瞬态响应的场合。

四、设计建议与注意事项

  • 外围元件选择:为保证稳定性与低噪声输出,建议使用低 ESR 输出电容和适当额定电流的电感。器件内部最大占空比为 15%,在降压与降压-升压转换设计时请确认占空比与元件取值满足输出要求。
  • 散热设计:尽管功率等级较小,但在持续高负载或高环境温度时仍需关注布局与散热路径,推荐将热敏引脚附近铜地扩展并优化散热走线。
  • PCB 布局:开关节点、功率回路与接地应尽量紧凑,开关回路环路面积越小越利于降低 EMI。模拟地与功率地的分割与合理汇流有助于提高稳定性与测量精度。
  • 保护与调试:在验证阶段建议添加可调限流与测量点,以便于观察启动、过载和异常保护动作,确认器件在实际负载和温度条件下的性能。

五、封装与采购信息

  • 封装形式:SOP-8,适合自动贴装与常规焊接工艺。
  • 产品定位:面向成本敏感且需多功能保护的小功率稳压场景。

总结:OB2222ECPA 以其高集成度、轻载高效模式和全面的保护功能,适合用于 5 V/100 mA 级别的非隔离降压或降压-升压电源设计。器件在 EMI 优化、瞬态响应和可靠性方面具有明显优势,能有效降低系统整体成本与设计复杂度。设计时应结合实际负载与热环境,合理选择外围元器件与 PCB 布局,以发挥器件最佳性能。

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