WMSIC Electronic Components

On-Bright OB2009MP

ModelOB2009MP
PackageSOT-23-6
BrandOn-Bright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
On-Bright OB2009MP
Type
ON-BRIGHT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON-BRIGHT
Electronic Component
OB2009MP
Electronic Component
1
Package
SOT-23-6
Type
AC-DC
Electronic Component
LEDDriver
Electronic Component
0.048g
Electronic Component
1
Channel Count
1
Electronic Component
BM0258733812
Operating Temperature
40℃~+150℃
Electronic Component
Electronic Component
Output Voltage
3V~28V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OB2009MP 产品概述

一、产品简介

OB2009MP(昂宝 On-Bright)是一款用于AC-DC LED驱动的控制器,封装为SOT-23-6,适用于单通道反激拓扑的恒流/恒压型LED驱动设计。器件支持外置开关管,输出可覆盖3V~28V范围,内部集成欠压保护(UVP),工作温度宽温域:-40℃~+150℃,适合耐高温及工业级照明应用。

二、主要特性

  • 类型:AC-DC LED驱动控制器(反激拓扑)
  • 通道数:1路输出控制
  • 输出电压范围:3V ~ 28V(适配多种LED串联方案)
  • 保护特性:欠压保护(UVP),建议系统层面补充过流、过压与短路保护
  • 开关管:外置(支持选择合适规格的MOSFET)
  • 封装:SOT-23-6,利于小体积设计
  • 工作温度:-40℃ ~ +150℃,适用于高温环境

三、典型应用场景

  • 室内/商业照明(筒灯、嵌入式灯)
  • 路灯与隧道照明(需耐粗犷环境)
  • 小功率恒流驱动电源模块
  • 需要外置MOSFET以实现高效率与热分摊的照明产品

四、功能与拓扑说明

OB2009MP 典型工作在反激(flyback)开关模式:市电经整流与滤波为反激变压器提供能量,OB2009MP 驱动外置开关管进行周期性能量传输,次级经整流稳压为LED供电。反馈可通过次级辅助绕组或光耦回馈至控制端,实现输出电压/电流调节。内置UVP用于检测控制电源电压,防止欠压工况下错误工作或损坏负载。

五、设计建议与注意事项

  • 外置MOSFET:选择耐高压(Vds裕量≥耐压峰值)、低Rds(on)且开关损耗小的器件;考虑峰值电流和开启损耗。
  • 辅助供电与启动:建议设计稳定的VCC辅助绕组或启动电路,配合VCC去耦电容,避免频繁重启。
  • 吸收与箝位:在主开关两端设计RCD吸收或TVS保护抑制尖峰,保护器件与变压器。
  • 电流采样:采样电阻布局靠近控制器CS引脚,回路尽量短,保证采样准确性。
  • EMI与滤波:加装输入EMI滤波与共模电感,遵守安规间隙与爬电距离。
  • 散热与封装:SOT-23-6有热限制,注意PCB散热铜箔和器件间距,评估高温下长期可靠性。
  • 可靠性保护:除UVP外,系统需考虑过流、过压、短路及过温保护策略。

六、封装与可靠性

SOT-23-6 小封装便于压缩系统体积,但热阻相对较高;在-40℃~+150℃工作范围内,建议在样机测试中进行温升、老化与高温应力验证,确保长期稳定性。总体而言,OB2009MP 适合需要外置开关管以优化效率和热设计的中低功率LED驱动方案。

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