Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ERJ3EKF27R0V
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANASONIC ERJ3EKF27R0V
- Type
- PANASONIC
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- PANASONIC
- Electronic Component
- ERJ3EKF27R0V
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 27Ω
- Electronic Component
- 1
- Electronic Component
- BM0259565117
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ERJ3EKF27R0V 产品概述
一、产品简介
ERJ3EKF27R0V 为 PANASONIC（松下）出品的厚膜贴片电阻，封装为 0603（1608 公制），阻值 27 Ω，精度 ±1%，额定功率 100 mW，温度系数（TCR）±100 ppm/℃。该器件适合对体积、精度与可靠性有一定要求的表面贴装电子设计。
二、主要参数
- 阻值：27 Ω
- 精度：±1%（F）
- 功率：100 mW（额定）
- 额定工作电压：75 V（器件允许的最高工作电压）
- 温度系数：±100 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0603（尺寸约 1.6 × 0.8 mm，厚度约 0.4–0.5 mm）
注：由功率限制计算得到的最大连续电压 V = sqrt(P·R) ≈ √(0.1 W × 27 Ω) ≈ 1.64 V。因此在实际设计中，应以此电压与额定电压的较低者为准，避免过热导致失效。
三、产品特点
- 小尺寸、高密度：0603 封装适合高密度 PCB 布局与自动化贴装。
- 精度与稳定性：±1% 精度配合 ±100 ppm/℃ 的 TCR，适合做精密分压、偏置网络等。
- 宽温度范围：-55 ℃ 至 +155 ℃，满足工业级温度场景。
- 厚膜工艺：工艺成熟，成本适中，具有良好的可焊性与长期可靠性。
四、典型应用
- 消费电子（便携设备、显示驱动）
- 模拟前端偏置与分压电路
- 滤波与限流电路（低功率场合）
- 工业控制与传感器接口（在额定功率范围内）
五、设计与焊接建议
- 功率与电压考虑：虽器件标注工作电压 75 V，但受功率限制，连续电压应控制在约 1.64 V 以下以避免过热。
- 降额规则：在高温下应进行线性降额处理（常见做法为在 70 ℃ 以内可近似满功率使用，高温时按厂商降额曲线处理），具体请参考厂方数据手册。
- 回流焊工艺：遵照 Panasonic 推荐的回流曲线，避免长时间高温暴露。
- 布局注意：为改善热耗散，可在 PCB 上增大铜箔面积或使用热过孔；避免把功耗较大的元件紧邻，减少局部聚热。
六、可靠性与环境适配
- 适用于工业级温区，抗振动和常规潮湿环境稳定性良好。
- 储存与清洗：常规贴片元件处理与清洗方式适用，无需特殊湿度控制，但建议遵循厂商保管期与防潮要求。
七、选型要点与注意事项
- 若电路电压或功率接近极限，应选用更高功率或更大封装的电阻以保证可靠性。
- 对极低 TCR 或高精度（<±0.1%）有要求的设计，应考虑薄膜或金属膜精密电阻器。
- 最终设计前应查阅 Panasonic 官方数据手册以获取完整的电气特性、降额曲线与可靠性试验数据。
总结：ERJ3EKF27R0V 为一款适合常规精密与工业应用的 0603 厚膜电阻，兼顾体积与精度。在选型与布局时重点关注功率与热管理，以确保长期稳定工作。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
