WMSIC Electronic Components

ERA3AEB151V

ModelERA3AEB151V
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERA3AEB151V
Type
0603
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERA3AEB151V
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.026g
Electronic Component
150Ω
Electronic Component
1
Electronic Component
BM0263496712
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERA3AEB151V 贴片薄膜电阻产品概述

一、产品基本信息

ERA3AEB151V是PANASONIC(松下) 推出的一款0603封装高精度薄膜贴片电阻,属于松下工业级电阻产品线。通过型号命名可快速识别核心特征:

  • 前缀“ERA3A”为薄膜电阻系列标识,代表松下成熟的薄膜沉积工艺;
  • “EB”后缀对应精度等级(±0.1%)与温度系数(±25ppm/℃);
  • “151”表示标称阻值为150Ω(前两位“15”+第三位“1”×10¹);
  • 尾缀“V”明确封装形式为0603(英制代码,对应公制尺寸1.6mm×0.8mm)。
    产品定位为小功率高精度电路的核心元件,适用于对阻值稳定性、精度要求严苛的场景。

二、核心性能参数

该电阻参数针对“高精度+宽温适应性”优化,关键指标可支撑多数工业/消费电子需求:

  1. 阻值与精度:标称150Ω,精度±0.1%——远高于普通电阻(±1%~±5%),可满足精密分压、基准电路等对阻值偏差敏感的应用;
  2. 功率与电压:额定功率100mW,最大工作电压75V。实际使用需满足“功耗≤100mW”“电压≤75V”,避免过功率/过电压损坏;
  3. 温度系数:±25ppm/℃——阻值随温度变化极小。例如,环境温度从-55℃升至155℃(变化210℃),阻值仅变化≈0.7875Ω,偏差可忽略;
  4. 工作温度范围:-55℃+155℃——覆盖工业级(-40℃85℃)、部分汽车级(-40℃~125℃)场景,可适应极端温度环境。

三、封装与应用场景

3.1 0603封装特点

0603是贴片电阻主流小封装之一,尺寸为1.6mm(长)×0.8mm(宽)×0.45mm(厚),优势显著:

  • 小体积:大幅减少PCB占用面积,适合智能手机、智能穿戴等小型化设备;
  • 自动化适配:支持SMT高速贴装,提高生产效率;
  • 散热性:薄膜电阻膜层均匀,0603封装可满足100mW小功率散热需求。

3.2 典型应用场景

因高精度、宽温、小体积特性,该电阻广泛用于:

  • 消费电子:智能手机触控传感器信号调理、智能手表心率监测电路的分压/滤波;
  • 工业控制:PLC模拟量输入模块校准电阻、工业传感器(温度/压力)信号放大电路;
  • 汽车电子:车载仪表盘背光控制、车身控制器小信号处理(适配车内-40℃~85℃环境);
  • 医疗设备:便携式血糖仪、血压计的高精度基准电路(稳定阻值保证测量准确)。

四、性能优势解析

  1. 高精度稳定:±0.1%精度+±25ppm/℃温漂,阻值一致性好,批量生产无明显漂移,适合对电路一致性要求高的场景;
  2. 宽温适应性:-55℃~155℃工作范围,可应对北方户外设备低温、烤箱内传感器高温等极端环境;
  3. 小体积高密度:0603封装支持PCB高密度布线,符合电子设备“轻薄化”趋势,尤其适合IoT终端;
  4. 品牌可靠性:松下采用成熟薄膜工艺,电阻膜层均匀,通过JIS C 5201、IEC 60115等国际标准测试,长期可靠性有保障。

五、选型与使用注意事项

  1. 功率匹配:实际功耗需≤100mW,避免长期过功率导致阻值漂移;
  2. 电压限制:最大工作电压75V,高压电路需串联降压;
  3. 焊接要求:回流焊需遵循松下推荐曲线(峰值245℃±5℃,时间≤10s),避免热应力损坏;
  4. 汽车级验证:若用于汽车场景,需确认实际温度是否在-40℃~125℃以内(该电阻155℃上限可覆盖)。

ERA3AEB151V凭借高精度、宽温、小体积特性,成为工业控制、消费电子等领域的高性价比选型,松下品牌背书进一步保障了长期可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.