WMSIC Electronic Components

ERTJ1VG103JA

ModelERTJ1VG103JA
Package0603
BrandPANASONIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANASONIC ERTJ1VG103JA
Type
0603
Minimum package
4000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
PANASONIC
Electronic Component
ERTJ1VG103JA
Electronic Component
1
Electronic Component
0.8mm
Package
0603
Electronic Component
NTCThermistor Resistor
Electronic Component
0.03g
Electronic Component
1.6mm
Electronic Component
10kΩ
Electronic Component
0.8mm
Electronic Component
1
B
±1%
Electronic Component
BM0264524836
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ERTJ1VG103JA 产品概述

一、产品概况

ERTJ1VG103JA 是松下(PANASONIC)推出的一款 SMD 贴片型 NTC 热敏电阻,封装规格为 0603(1.6 × 0.8 × 0.8 mm)。标称阻值 10 kΩ(25℃),B 值(25/50)为 3380 K,(25/85)为 3435 K,B 值精度 ±1%,阻值公差 ±5%,额定耗散功率 100 mW,工作温度范围 -40℃ 至 +125℃,耗散系数(热耗散常数)约 3 mW/℃。该型号适合对温度进行精确检测与补偿控制的小尺寸应用。

二、主要性能参数

  • 标称阻值(25℃):10 kΩ(±5%)
  • B 值:3380 K(25/50)、3435 K(25/85),精度 ±1%
  • 额定功率:100 mW(典型规格,实际使用请参照应用温度及散热条件)
  • 耗散系数:3 mW/℃(用于评估自热影响)
  • 工作温度范围:-40℃ ~ +125℃
  • 封装:0603,SMD,尺寸 1.6 × 0.8 × 0.8 mm

三、关键特性与优势

  • 高精度 B 值(±1%)便于建立准确的阻值-温度转换模型,提高温度测量线性与可重复性。
  • 小型 0603 封装,适合对 PCB 空间限制严格的便携式与消费电子设备。
  • 低耗散系数意味着在小电流测量时自热引起的温度偏差较小,适合低功率温度监测。
  • 宽工作温度与较高额定功率,兼具耐受性与可靠性,适应常见工业与消费场景。

四、典型应用场景

  • 电池组与电源管理的温度检测与补偿
  • 智能家居、可穿戴设备与消费类电子的环境温度监测
  • 温度补偿电路(例如晶振、RTC 等对温度敏感元件)
  • 工业控制与散热策略中的局部温度采样点

五、使用与设计注意事项

  • 测量电路中尽量采用小测量电流以降低自加热误差,结合耗散系数估算温升:P = I^2·R,ΔT ≈ P / K(K 为耗散系数)。
  • 阻值-温度换算可采用 B 参数公式:R(T) = R25 · exp[B (1/T - 1/T0)](T 单位为 K,T0=298.15 K)。
  • 设计 PCB 链接与焊盘时参考 0603 标准封装,保持良好热导路径或隔热布局以满足测量目的。
  • 焊接时遵循制造商回流焊推荐温度曲线,避免长期高温暴露导致参数漂移。
  • 在高湿、腐蚀环境下建议采取防护涂层或封装保护措施。

六、封装与可靠性

ERTJ1VG103JA 属于标准 0603 SMD 物料,适配常见贴片贴装与回流焊流程。松下对其材料与温度系数控制严格,适合追求批次一致性与长期稳定性的应用。仓储与使用应避免潮湿及强酸碱环境,开卷后按贴片元件吸湿性处理标准操作。

如需进一步的电气特性曲线、温度-阻值对照表或推荐的 PCB 焊盘尺寸,请参阅松下官方数据表或联系供应商获取完整技术文档。

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