Model & package intelligence
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PANJIT BAS100CS-AU_R1_000A1 BAS100CS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PANJIT BAS100CS-AU_R1_000A1
- Type
- PANJIT
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PANJIT
- Electronic Component
- BAS100CS-AU_R1_000A1
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0227252339
- Current
- 500mA
- Diode
- Electronic Component
- Current(Ir)
- 15nA@80V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS100CS-AU_R1_000A1 产品概述
一、概述
BAS100CS-AU_R1_000A1 为强茂（PANJIT）出品的独立式肖特基整流二极管，采用 SOD-323 小型表贴封装。器件设计用于低压降、快速开关和高可靠性整流场合，适合空间受限的消费电子、通信及电源前端保护等应用。工作结温范围宽（-55℃ ~ +150℃），能够在较苛刻环境下保持稳定性能。
二、主要特性
- 肖特基结结构，低正向压降：Vf = 850 mV @ If = 0.5 A，有助于降低导通损耗与发热。
- 直流正向电流：If(整流) = 500 mA，满足中小电流整流需求。
- 非重复峰值浪涌电流 Ifsm = 5.5 A，具备良好的抗浪涌能力。
- 反向耐压 Vr = 100 V，适用于高压侧保护和整流应用。
- 低反向漏电流 Ir = 15 nA @ 80 V，减少静态损耗并适合低功耗系统。
- 紧凑 SOD-323 封装，便于高密度 PCB 布局与自动贴片生产。
三、典型应用场景
- 电源输入端防反接与整流，减少正向压降以提高转换效率；
- 电源回路中的续流/钳位保护与阻尼；
- 便携设备与电池供电系统，减少待机功耗和热量积累；
- 通信设备与模块的高压侧保护；
- 各类消费电子中作为快速整流或保护元件使用。
四、电气与热管理建议
器件在高电流或高环境温度下应注意热沉与散热设计。由于 Vf 与电流成正比，功耗近似为 P ≈ Vf × If，设计时按最坏工况评估结温上升并预留足够的降额裕量。长期工作或频繁浪涌应考虑适当降额或采用并联/更大封装器件。
五、封装与焊接注意
SOD-323 为小型贴片封装，推荐遵循 PANJIT 的封装尺寸与 PCB 针脚焊盘推荐图。建议使用标准回流焊流程，控制峰值温度和时间以避免封装应力。装配时注意极性标识，避免反向安装造成损坏。
六、典型电路参考
- 输入反接保护：串联在电源正极，正向导通时损耗低，反向时阻断保护后续电路。
- 脉冲钳位：与 TVS 或 RC 网络配合，用于吸收瞬态过电压。
- 低压降整流桥（并联或与其他肖特基配合）：提高整流效率并降低浪涌时的应力。
七、订购与选型提醒
订购时请确认完整料号 BAS100CS-AU_R1_000A1、封装 SOD-323 及包装形式（卷带/盘装）。在对温度、浪涌和长期可靠性有更高要求的应用中，建议参考厂家完整数据手册，依据实际工况进行热仿真与寿命评估。若需替代或并联使用，请确保参数匹配以避免应力不均。
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