WMSIC Electronic Components

PANJIT RS1MF-LE_R1_00001 RS1MF

ModelRS1MF-LE_R1_00001
PackageSMAF
BrandPANJIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PANJIT RS1MF-LE_R1_00001
Type
SMAF
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PANJIT
Electronic Component
RS1MF-LE_R1_00001
Electronic Component
1
Package
SMAF
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.056g
Electronic Component
1
Electronic Component
BM0263665327
Current
1A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS1MF-LE_R1_00001 产品概述

一、产品简介

RS1MF-LE_R1_00001 是 PANJIT(强茂)推出的一款独立式快恢复/高效率二极管,封装为 SMAF。该器件面向高电压、高效率整流与开关电源回路,具有 1kV 的直流反向耐压和 1A 的整流电流能力,兼顾低正向压降与较快的恢复特性,适用于各种工业与消费类电源应用。

二、主要性能特点

  • 正向压降 Vf = 1.3V @ 1A,低压降有利于提高整流效率并降低发热。
  • 直流反向耐压 Vr = 1kV,适合高压整流与阻断场合。
  • 额定整流电流 1A,适合中小功率整流用途。
  • 反向电流 Ir = 5µA @ 1kV,漏电低,有利于高压系统的静态功耗控制。
  • 反向恢复时间 Trr = 500ns,属于快恢复类型,可减少开关损耗与电磁干扰。
  • 非重复峰值浪涌电流 Ifsm = 25A,可承受启动或短时冲击电流。
  • 工作结温范围 -55℃ ~ +150℃,适应较宽温度环境。

三、典型应用场景

  • 开关电源(SMPS)高压整流与回收电路;
  • 电源适配器、充电器的高压侧整流;
  • 逆变器与电机驱动中的快恢复整流;
  • 谐振/续流回路、续流二极管及吸收电路;
  • 高压测量与保护电路,要求低漏电与高耐压的场合。

四、封装与可靠性

SMAF 小型表面贴装封装,便于自动化贴装与高密度 PCB 布局。封装对于热阻与散热路径有一定限制,建议在设计中考虑良好铜箔散热、短引线与必要的散热区域。器件在 -55℃ 至 +150℃ 的结温范围内可长期工作,但在高温下正向电压和反向漏电会变化,需按规范进行热设计与电流降额。

五、使用建议

  • 高频开关应用中,500ns 的 Trr 可以显著降低开关损耗,但在超高频场合仍需评估回恢复相关的尖峰电压与 EMI,必要时配合缓冲电阻或 RC 吸收网络。
  • 对于 1kV 等级的器件,PCB 设计应注意爬电与间隙距离,避免污染或高湿环境下的击穿风险。
  • 长时间或重复性浪涌应参考 Ifsm 25A 的非重复峰值限制,必要时增设保护器件。
  • 考虑反向漏电随温度上升增加,关键精密或静态高压系统应做温漂评估。

六、小结

RS1MF-LE_R1_00001 将高耐压(1kV)、低漏电与较低正向压降相结合,并具备 500ns 的快恢复性能,适合需要兼顾效率、耐压与抗浪涌能力的中小功率电源与整流应用。合理的 PCB 散热设计与过压/浪涌保护能最大化器件可靠性与寿命。若需更详细的电气特性曲线、封装尺寸或样片测试报告,可联系供应商或查阅 PANJIT 官方资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.