WMSIC Electronic Components

PROD PSTMAA252012-2R2MB PSTMAA252012

ModelPSTMAA252012-2R2MB
Package1008
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSTMAA252012-2R2MB
Type
PROD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSTMAA252012-2R2MB
Electronic Component
1
Package
1008
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.065g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0257674285
Current
3.9A
Resistor(DCR)
60mΩ
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSTMAA252012-2R2MB 产品概述

一、主要参数

  • 品牌:PROD(谱罗德)
  • 型号:PSTMAA252012-2R2MB
  • 电感值:2.2 µH(公差 ±20%)
  • 额定电流(Ir):3.9 A
  • 饱和电流(Isat):4.1 A(定义为电感下降到初始值一定比例时的电流)
  • 直流电阻(DCR):60 mΩ
  • 类型:扁平线一体成型电感(扁线绕制、整体注塑封装)
  • 封装:1008(具体外形尺寸与引脚定义请以厂方数据手册为准)

二、产品特点

  • 高电流能力:额定电流 3.9 A,适合中高电流的降压转换与负载滤波应用。
  • 低直流电阻:60 mΩ 的 DCR 有利于降低功耗与发热,提高系统效率。
  • 抗饱和设计:Isat 为 4.1 A,可在较大电流下保持电感特性,适合瞬态电流较大的场合。
  • 扁平线结构:扁线绕制与一体成型工艺提升绕组填充率和热传导性能,机械强度好、对高频损耗控制更有优势。
  • 表面贴装:适合自动化 SMT 生产,良好的可重复焊接性与可靠性。

三、典型应用场景

  • 开关电源(DC-DC 降压转换器)中的输入/输出滤波与能量储存。
  • 高性能处理器、FPGA、基站、电源模块等对大电流轨道的去耦与能量传输。
  • 汽车电子、工业电源、通信设备等对可靠性和温升有要求的系统(使用前请确认车规等级与认证)。
  • 电池供电设备、便携式设备的能量管理电路。

四、设计与使用建议

  • 电流裕量:为避免接近饱和区,建议在实际工况下留有 20% 以上的电流裕量,尤其当芯片出现峰值脉冲电流时需考虑短时冲击。
  • 热管理:尽量靠近散热良好的铜箔区域布线,增加过孔或大面积地铜以利散热,避免长期高负载导致过热。
  • 布局注意:输入/输出回路走线尽量短而粗,绕组两端引线与开关器件靠近,有助于降低寄生阻抗和EMI。
  • 焊接工艺:遵循厂方推荐的回流温度曲线与时间,避免多次高温重复焊接造成性能退化。
  • 环境与可靠性:在高湿、高振动或盐雾环境中使用前建议参考完整的可靠性试验数据。

五、选型与替换注意事项

  • 同等电感值下优先比较 DCR、额定电流与 Isat,以确保在目标电流和温升条件下稳定工作。
  • 若电路对电感容差、温度特性或频域阻抗有严格要求,建议参考完整频率特性曲线和温度漂移数据。
  • 换型时注意封装尺寸、焊盘布局及引脚位置匹配,避免因机械不符导致安装或热阻问题。
  • 如需更高电流或更低DCR,可咨询厂家同系列更大规格或定制化产品。

以上为 PSTMAA252012-2R2MB 的概要说明,如需完整电气曲线、温升试验、机械尺寸或样品测试报告,请联系谱罗德(PROD)或索取该型号的官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.