WMSIC Electronic Components

PROD PDPTAT0608-100M PDPTAT0608

ModelPDPTAT0608-100M
PackageTHT,D7.5XL10MM
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PDPTAT0608-100M
Type
THT, D7.5XL10MM
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PDPTAT0608-100M
Electronic Component
1
Package
Through-hole, D7.5x L10mm
Type
Inductor
Electronic Component
Color Ring / Through-hole Inductor
Electronic Component
±20%
Electronic Component
1.054g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0227741570
Current
3A
Resistor(DCR)
36mΩ
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PDPTAT0608-100M 产品概述

一、产品简介

PDPTAT0608-100M 是谱罗德(PROD)推出的一款插件工字电感,电感值为 10 µH,公差 ±20%,额定电流 3.0 A,饱和电流(Isat)3.1 A,直流电阻(DCR)约 36 mΩ。封装为插件型,外形尺寸约 D7.5 × L10 mm,常见为色环标识,便于手工装配与快速识别。该器件针对中低频功率滤波与 EMI 抑制设计,适合要求体积小、通流能力中等的开关电源与电源滤波场合。

二、主要性能特点

  • 标称电感:10 µH,允许偏差 ±20%,满足常见滤波与振荡回路设计容差需求。
  • 额定电流:3.0 A;饱和电流 3.1 A(注意 Isat 与额定电流接近,应预留裕量以避免工作点进入饱和区)。
  • 直流电阻:约 36 mΩ,低 DCR 有利于减小 I²R 损耗;在额定电流下的铜损约为 P = I²·DCR ≈ 0.324 W(3.0 A 条件下),设计时需考虑热量散发。
  • 结构形态:工字电感,插件引出,便于通孔焊接与维修替换。
  • 封装尺寸紧凑:D7.5×L10 mm,有利于在受限空间内实现滤波布局。

三、典型应用场景

  • 开关电源(DC-DC)输出滤波:用于降频段的能量传输与输出纹波抑制。
  • 电源输入滤波与 EMI 抑制:与电容配合构成 LC 或 π 型滤波网,抑制导入/传导干扰。
  • LED 驱动与车载电子(低功率模块):在 3 A 范围内为驱动电路提供滤波与能量贮存。
  • 工业控制与家电小功率电源:替代较大体积的同类电感件以实现紧凑布局。

四、选型与使用建议

  • 电流裕量:由于 Isat(3.1 A)与额定电流(3.0 A)差距小,若电路存在冲击电流或较高直流偏置,应选择更高 Isat 的型号或在运行电流上留出裕量(建议工作电流 ≤ 额定电流的 80–90%)。
  • 温升与散热:按实际工作电流计算铜损并评估 PCB 散热条件;若长期高负载运行,建议增加散热面或改用低 DCR 型号。
  • 电感偏置特性:工字电感在直流偏置下会出现电感降低,设计时需参考实际电感随偏置电流的变化曲线(如无曲线,做预留裕度)。
  • 容差影响:±20% 容差对谐振频率与滤波性能有明显影响,关键滤波回路建议选用容差更小或进行实际调试。

五、封装与机械信息

  • 型号:PDPTAT0608-100M
  • 品牌:PROD(谱罗德)
  • 封装形式:插件 / 通孔引脚
  • 外形尺寸(典型):直径约 7.5 mm,长度约 10 mm(D7.5 × L10 mm),色环标识便于档位识别。
  • 安装建议:推荐通孔焊接并在焊接后检查焊点完整性与机械强度;留足周围间距以利散热与磁场减小对周边器件的耦合。

六、注意事项与可靠性

  • 焊接工艺:建议遵循厂商焊接温度与时长建议;波峰或手工焊时注意避免过高温度或过长时间导致漆包线绝缘损伤。
  • 环境与存储:避免长期潮湿、高温环境,存储时防潮包装可延长可靠性。
  • 电磁兼容(EMC):工字结构在布局时应注意与敏感信号线的距离,必要时加磁屏蔽或调整走线以降低干扰耦合。
  • 测试与验证:在最终产品中做电感实际 L、DCR、温升及频率响应测试,验证与仿真数据的一致性,确保满足产品长期可靠性要求。

如需样品、详细频率特性曲线或额外机械图纸,可联系供应商或谱罗德技术支持获取完整数据手册与应用资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.