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PSA FS55X226K101LRG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FS55X226K101LRG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FS55X226K101LRG
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 2220
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.841g
- Electronic Component
- 1
- Electronic Component
- BM0257412002
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FS55X226K101LRG 产品概述
一、产品简介
FS55X226K101LRG 为 PSA（信昌电陶）推出的一款高电压多层陶瓷贴片电容（MLCC），容值 22 μF，标称精度 ±10%，额定电压 100 V，介质类型 X7R，封装规格 2220（EIA 0.22"×0.20"，约 5.6×5.0 mm）。该型号适合在要求体积较小且需耐高压的电源与滤波场景中替代电解或钽电容，实现更长寿命与更高可靠性的方案。
二、主要特性
- 高额定电压：100 V，适用于中高压直流总线、功率模块与电源输入滤波。
- 大容量：22 μF，在 MLCC 中属于较高容值，有利于降低系统纹波与瞬态电压跳变。
- X7R 介质：工作温度范围广（常见 -55°C 至 +125°C），温度稳定性优于 Y5V/ Z5U，但非精密稳定型介质（非 C0G）。
- 低等效串联阻抗（ESR）与低损耗：适合高频去耦与快速脉冲吸收。
- 贴片封装 2220：便于 SMT 自动贴装与可靠焊接，大电流路径能力更强。
三、典型应用
- 开关电源的输入/输出滤波与直流母线去耦；
- 电机驱动、逆变器的旁路与能量缓冲；
- 高压测量/采集电路中的滤波与旁路；
- 音频/射频耦合与旁路（视频带要求而定）。
四、封装与可靠性
2220 尺寸提供较大的极板面积和更高的电容量密度，但同时对机械应力敏感。PSA 的该系列经过贴片工艺与热循环测试，满足常规工业环境可靠性要求。建议参考厂商完整可靠性报告（包括温度循环、湿热、功率循环与焊接耐受性）以满足关键应用的认证需求。
五、设计与使用建议
- DC bias 影响：高电压下电容有效容值会下降，100 V 工作点处需参考厂商 DC-bias 曲线并预留裕量；必要时并联多个电容或与薄膜/电解电容混合使用以保证低频能量储存。
- 布局：靠近电源器件布置以缩短回流路径，使用足够的焊盘与过孔以降低寄生电感。
- 焊接：遵循 SMT 回流温度曲线，避免过度机械应力与温度冲击，推荐使用适当的助焊膏与良好 PCB 支撑。
六、注意事项
- X7R 介质虽温度范围广，但并非线性电容，随温度与电压有容值漂移；不适用于要求长期高精度的时间常数电路。
- 对振动与弯曲敏感，板上应避免大位移应力并采用合适的布局与固定措施。
- 具体电气与机械参数、DC-bias 曲线和可靠性数据请以 PSA（信昌电陶）官方数据手册为准。
以上为 FS55X226K101LRG 的产品概述与工程应用要点，供选型与电路设计参考。若需更详细的电气特性曲线或尺寸图纸，我可以进一步提供或帮助解读厂商数据表。
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