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PSA FN18N120J500PSG
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FN18N120J500PSG
- Type
- PSA
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FN18N120J500PSG
- Electronic Component
- 1
- Electronic Component
- 12pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0257411981
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FN18N120J500PSG 产品概述
一、产品简介
FN18N120J500PSG 为 PSA（信昌电陶）系列贴片多层陶瓷电容器（MLCC），规格为 12 pF、容差 ±5%、额定电压 50 V，温度特性为 C0G（亦称 NP0），封装尺寸为 0603（约 1.6 mm × 0.8 mm）。该型号适用于对温漂、频率特性和长期稳定性有较高要求的射频与高精度信号电路。
二、主要技术参数
- 容值：12 pF
- 精度：±5%
- 额定电压：50 V DC
- 温度系数：C0G（0 ±30 ppm/°C，近似线性，温度稳定）
- 封装：0603（1608 米制）
- 包装形式：卷盘贴片（请按具体订单确认）
三、核心特性
- 高频性能优秀：C0G 材料介电损耗低、介电常数稳定，适合高频滤波、阻抗匹配和谐波抑制。
- 温度稳定性好：C0G 的电容随温度变化极小，适合精密定时与谐振电路。
- 低电压依赖性：在工作电压范围内容值变化微小，利于精确电路设计。
- 封装小型化：0603 尺寸兼顾体积与装配可靠性，适用于空间受限的现代电子产品。
四、典型应用
- 高频 RF 前端（匹配、旁路与耦合）
- 精密时钟、谐振与滤波电路
- ADC/DAC 采样路径与参考网络
- 通信设备、仪器仪表、消费电子及汽车电子（需按汽车级可靠性额外确认）
五、封装与焊接注意事项
- 0603 尺寸需注意焊盘设计与回流焊参数以避免热应力。
- 建议遵循 PSA 提供的回流焊曲线（无铅回流峰值通常 ≤ 260°C），并避免多次高温循环。
- 焊盘和锡膏覆盖应均匀，防止应力集中导致裂纹或失效。
- 取放与贴装过程中避免机械冲击与过度弯曲基板。
六、储存与可靠性
- 推荐在干燥、常温、避光环境中储存，避免潮湿与强腐蚀性气体。
- 长期库存前建议封装未开封并在规定期限内使用，开封后尽快回流焊作业。
- 对于可靠性要求较高的场景（如汽车或医疗），建议参考厂家可靠性试验报告并进行批次验证。
七、选型与订购建议
- 若需要更高电压或更小/更大容值，请参考 PSA 系列其他型号或联系厂家咨询。
- 在高频或精密应用中，优先选择 C0G/NP0 温度特性的同类器件以保证性能一致性。
- 下单时请确认包装规格（卷盘方向、数量）和供货证明（批次、合格证、RoHS 等）。
如需更详细的电气特性曲线、机械尺寸图或回流焊曲线，请提供联系方式或向供应商索取完整 datasheet。
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