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PSA FN18N470J500PSG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FN18N470J500PSG
- Type
- PSA
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FN18N470J500PSG
- Electronic Component
- 1
- Electronic Component
- 47pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0257411983
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FN18N470J500PSG 产品概述
一、产品简介
FN18N470J500PSG 为 PSA（信昌电陶）出品的贴片多层陶瓷电容（MLCC），标称电容值 47 pF，容差 ±5%（J），额定电压 50 V，温度系数为 C0G（又称 NP0）。封装为 0603（约 1.6 mm × 0.8 mm），适用于要求高稳定性、低介质损耗和宽频特性的应用场合。
二、主要特性与优势
- 稳定的温度特性：C0G/NP0 材料具有极低的温度系数（±30 ppm/°C 级别），在 -55°C 到 +125°C 范围内电容变化极小，适合频率敏感和时间基准电路。
- 低损耗、高 Q 值：介质损耗小，等效串联电阻（ESR）和等效串联电感（ESL）低，适合高频滤波与射频匹配。
- 精密容差：±5%（J）保证了在滤波、谐振或定时电路中的重复性与一致性。
- SMD 0603 小封装：体积小、适合高密度 PCB 布局与自动化贴装。
- 可靠性：适合流行的回流焊工艺，通常满足常规温度循环、湿热和机械冲击测试要求。
三、典型应用
- 高频滤波、阻抗匹配与谐振电路（射频前端、天线匹配）
- 晶振与振荡器的定容与补偿元件
- 精密模拟与量测电路（采样、滤波、相位网络）
- 高速数字电路中的去耦与终端匹配（对频率稳定性要求高的场合）
四、关键规格参数（摘要）
- 电容值：47 pF
- 容差：±5%（J）
- 额定电压：50 V DC
- 温度系数：C0G / NP0（极低温漂）
- 封装：0603（约 1.6 × 0.8 mm）
- 封装形式：SMD，卷带包装（常见）
- 材料类型：多层陶瓷（NP0/C0G）
五、装配与使用注意事项
- 推荐采用标准无铅回流焊工艺，严格控制预热和峰值温度以避免裂纹与性能退化。
- 为降低贴装缺陷（如 tombstoning），在 PCB 焊盘长度、焊膏印刷和回流曲线上遵循器件厂商推荐设计。
- 储存与防潮：尽量在干燥环境下保存，长期暴露高湿环境可能导致焊接质量问题。
- 在高频设计中注意寄生参数（ESL、ESR）对电路响应的影响，必要时参考厂商的等效电路模型或测量数据。
六、选型建议
当电路对温度稳定性、频率稳定和低损耗有严格要求时，优先选择 C0G/NP0 类型的 MLCC；若需要更大容量且对温漂允许较宽，可考虑 X7R、X5R 等介质。0603 封装在兼顾体积和可焊性的场合常为首选；若功率或电压需求更高，可改选更大封装或更高额定电压型号。
如需更详细的电气模型、回流焊曲线或可靠性报告，可向 PSA（信昌电陶）索取完整数据手册与应用指南。
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