WMSIC Electronic Components

PSA FS32X106K101EGG

ModelFS32X106K101EGG
Package1210
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FS32X106K101EGG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FS32X106K101EGG
Electronic Component
1
Electronic Component
10uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.19g
Electronic Component
1
Electronic Component
BM0257411999
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FS32X106K101EGG — 贴片多层陶瓷电容器(MLCC)产品概述

一、产品简介

FS32X106K101EGG 为 PSA(信昌电陶)品牌的一款高压贴片多层陶瓷电容器(MLCC),标称容量 10 μF,初始容差 ±10%,额定直流电压 100 V,介质材料为 X7R,封装尺寸 1210(约 3.2 × 2.5 mm)。该型号定位为中高压场合下的去耦、旁路与储能电容,兼顾体积与电容量的平衡,适用于工业电源与电源转换模块等应用。

二、主要性能与电气参数

  • 标称电容:10 μF
  • 容差:±10%
  • 额定电压:100 V DC
  • 介质温度特性:X7R(工作温度范围典型为 −55 ℃ 至 +125 ℃,温度范围内电容变化一般在 ±15% 以内)
  • 封装:1210(贴片)
  • 品牌:PSA(信昌电陶)

注意:X7R 为类 II 陶瓷介质,虽具有较高的比容,但在直流偏压(DC bias)下会出现显著的容量降低,实际工作电压接近额定值时有效电容可能下降,具体降幅应以厂方数据或实际测量为准。

三、主要特点

  • 高额定电压(100 V),适合高压电源回路与中高压滤波
  • 相对较大的单颗容量(10 μF),可减少并联器件数量
  • X7R 介质在宽温度范围内保持较好稳定性,适用于一般工业环境
  • 1210 封装便于自动贴装,适配主流回流焊工艺

四、典型应用场景

  • 开关电源(DC-DC)输出滤波与能量缓冲
  • 工业电源与驱动电路的高压去耦
  • 电源输入滤波、EMI 滤波网络
  • 需要在有限面积内实现较大电容量的高压电路

五、选型与设计注意事项

  • DC bias 效应:X7R 在高偏压下电容下降明显,设计时应考虑容量裕量,必要时通过并联多颗或选用更高容值/低损介质方案补偿。
  • 温度与频率依赖:X7R 的频率特性与温度特性会影响滤波、旁路效果,关键电路应做实际频域测试。
  • PCB 布局:尽量靠近被去耦器件放置,缩短回流环路、减少引线长度;对高电流应用可采用多颗并联以降低等效 ESR/ESL。
  • 焊接工艺:兼容无铅回流焊;建议按厂方或 IPC/JEDEC 推荐的封装回流曲线执行,以避免温度应力和机械损伤。

六、可靠性与包装、储存

  • 建议按厂方要求进行机械与环境应力评估,避免在应力集中位置(如 PCB 边缘)产生弯曲裂纹。
  • 出货通常为卷装(Tape & Reel),便于 SMT 贴装;收存时应避免潮湿、高温与强酸碱环境,防止端端电极或包装受损。
  • 操作、检修时注意防静电措施与避免过度机械挤压。

总结:FS32X106K101EGG 是一款面向高压场合的 10 μF/100 V X7R 贴片电容,兼顾体积与电容量的通用型产品。用于关键电源去耦与滤波时,应重视 DC bias 与温度/频率特性,必要时参考 PSA 官方技术资料或样品测试以确保设计可靠性。

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