WMSIC Electronic Components

PSA FN18N181J500PSG

ModelFN18N181J500PSG
Package0603
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FN18N181J500PSG
Type
PSA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FN18N181J500PSG
Electronic Component
1
Electronic Component
180pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0264906326
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FN18N181J500PSG 产品概述

一、产品基本定位与型号解析

FN18N181J500PSG是PSA信昌电陶推出的一款0603封装贴片多层陶瓷电容(MLCC),属于C0G(NP0)材质系列,专为中低压精密电子电路设计,兼具小型化、高稳定性与低损耗特性。

型号编码拆解:

  • “181”:标称容值180pF(18×10¹pF);
  • “J”:容值精度±5%;
  • “500”:额定直流电压50V;
  • “0603”:英制封装规格(公制1608,即1.6mm×0.8mm);
  • 后缀“PSG”:PSA品牌专属标识,代表工艺与品质等级。

二、核心参数详细说明

1. 容值与精度

标称容值180pF,精度等级为J档(±5%),无需额外匹配调整即可满足常规精密电路对容值一致性的要求,尤其适合对容值漂移敏感的高频/振荡电路。

2. 额定电压

直流额定电压50V,可稳定工作在0~50V电压范围,覆盖多数中低压电子系统(如消费电子、工业控制)的供电需求,无需降额使用(常规降额系数1.2倍时,实际耐压可达60V)。

3. 温度系数

采用C0G(NP0)陶瓷材质,温度系数≤±30ppm/℃(工作温度范围-55℃~125℃),是目前陶瓷电容中温度稳定性最高的材质之一——容值随温度、电压变化极小,几乎无老化效应。

4. 封装规格

0603英制封装(公制1.6mm×0.8mm×0.8mm),引脚间距0.5mm,体积仅为传统插件电容的1/10,适配高密度PCB布局与轻薄化产品设计。

三、关键技术特性

1. 超高温度稳定性

对比X7R(±15%容值漂移)、Y5V(±82%容值漂移)等材质,C0G的容值漂移可忽略,能在极端温度(如车载-40℃85℃、工业-55℃125℃)下保持电路性能一致性,避免信号失真。

2. 低损耗与高Q值

高频损耗极低(DF≤0.15%@1kHz),Q值(品质因数)可达1000+(1MHz下),适合射频(RF)、振荡、滤波等高频电路,减少信号衰减与干扰。

3. 高可靠性与长寿命

PSA信昌电陶采用成熟的多层陶瓷叠层工艺,产品经过高温老化(125℃×1000h)、湿度循环(85℃/85%RH×500h)、振动测试(10~2000Hz) 等严格验证,平均寿命超10万小时,符合汽车电子(小信号场景)与工业级应用要求。

4. 环保合规

符合RoHS2.0、REACH等国际环保标准,无铅无卤,适配全球市场准入需求,避免环保合规风险。

四、典型应用领域

1. 射频通信模块

WiFi 6、蓝牙5.0、LoRa等无线通信模块中的滤波、耦合电容,利用低损耗特性减少信号干扰与传输损耗,提升通信稳定性。

2. 精密电子仪器

示波器、信号发生器、频谱分析仪等的振荡回路、滤波网络,C0G的高稳定性确保测量精度不受温度影响,避免仪器误差。

3. 消费电子终端

智能手机、平板电脑、智能手表的射频前端、天线匹配电路,0603封装适配轻薄化设计,满足便携设备的高密度布局需求。

4. 工业控制电路

PLC、传感器接口、电机驱动的滤波电容,宽温性能与高可靠性减少工业环境(振动、温湿度变化)下的故障风险,提升系统稳定性。

5. 汽车电子(小信号场景)

车载信息娱乐系统、胎压监测模块的小信号处理电路,满足车载温度(-40℃~85℃)与振动要求,保障汽车电子系统的长期稳定运行。

五、品牌与可靠性保障

PSA信昌电陶是国内MLCC领域的龙头企业之一,拥有20余年陶瓷电容研发与生产经验,产品覆盖C0G、X7R、Y5V等全系列材质,产能与品质稳定。

FN18N181J500PSG通过以下认证与测试:

  • ISO9001质量管理体系、ISO14001环境管理体系认证;
  • IEC 60384-1国际电子元器件标准测试;
  • 汽车电子AEC-Q200认证(部分批次);
  • 提供完整的质量追溯体系,支持客户全流程质量管控。

六、封装与工艺兼容性

1. 封装尺寸

公制:1.6mm(长)×0.8mm(宽)×0.8mm(厚);
引脚焊盘:0.3mm×0.5mm(典型值),符合IPC-A-610标准。

2. 贴装工艺

兼容回流焊(温度曲线:预热150180℃,峰值240260℃)、波峰焊工艺,贴装精度可达±0.1mm,适配自动化SMT生产线。

3. 包装规格

常规包装为卷带(Tape & Reel),每盘3000~5000pcs,适合批量自动贴装,减少人工成本与元件损耗。

综上,FN18N181J500PSG凭借C0G材质的高稳定性、低损耗特性,以及0603封装的小型化优势,成为精密电子、射频通信、工业控制等领域的理想电容选择,可有效提升电路性能与产品可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.