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PSA FM31X104K251EEG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM31X104K251EEG
- Type
- PSA
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM31X104K251EEG
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.053g
- Electronic Component
- 1
- Electronic Component
- BM0257411987
- Electronic Component
- X7R
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM31X104K251EEG 产品概述
一、产品简介
FM31X104K251EEG 是 PSA（信昌电陶）推出的一款多层陶瓷贴片电容（MLCC），额定电容 100nF，公差 ±10%，额定电压 250V，介质等级 X7R，常见封装为 1206（约 3.2mm × 1.6mm）。该器件适用于对体积、稳定性和耐压有中等要求的去耦、滤波与旁路场合。
二、主要参数
- 容值：100nF（0.1µF）
- 公差：±10%（常温）
- 额定电压：250V DC（额定耐压）
- 介质：X7R（-55°C 至 +125°C，温度下容值有一定漂移特性）
- 封装：1206（贴片）
- 品牌：PSA（信昌电陶）
三、性能特性
- 稳定性与体积优化：在中等温度范围内提供较高的电容密度，适合空间受限的 SMT 布局。
- 温度特性：X7R 属于 II 类介质，温度范围内的容值变化通常比 NP0 大，设计时需考虑温漂对电路的影响。
- 直流偏置效应：在施加直流电压时，尤其接近额定电压时，实际有效电容会下降，具体降幅与介质、厚度有关，应参考厂方曲线或实测结果。
- 高频特性：MLCC 自身 ESL 低，适合去耦和旁路；但不提供像薄膜电容那样的安规隔离功能。
四、典型应用场景
- 电源去耦与旁路：为数字芯片、电源管理模块提供局部滤波，降低电源噪声。
- EMI/噪声抑制：配合电感或共模滤波器用于高频噪声抑制。
- 耦合/分频网络：在非安规的信号通路中作为耦合或时间常数元件使用。
注意：X7R 非安规介质，不可替代安规 X/Y 电容于直接跨网电压安全应用。
五、设计与使用注意事项
- 直流偏置与温漂：在关键电路（如定时、高精度滤波）中，应考虑温漂与直流偏置导致的容值变化，必要时选用更稳定的介质或更大容值。
- 回流焊与工艺：遵循厂家推荐的回流曲线进行焊接，避免超温或过长浸泡时间。贴装时注意不要施加过大的机械应力（剪切、弯曲），避免引起芯片裂纹。
- 清洁与储存：按厂家湿敏等级（MSL）与包装要求存放，必要时回流前进行预烘烤以除湿。
- 安规注意：不得用于要求 Y/X 安规认证的跨网隔离或直接连接到电源线的安全关键场合。
六、封装、可靠性与检验
常用为卷盘（reel）供货，适配自动贴片生产线。出厂前通常通过外观、尺寸、电容量和耐压测试；对抗热循环、机械振动和焊接可靠性有良好表现，但具体寿命与环境应按应用场景和厂家可靠性报告评估。
七、采购与技术支持
订购时请向 PSA（信昌电陶）或其授权分销商获取完整规格书、直流偏置曲线与回流工艺建议，确认 RoHS/REACH 等合规文件及包装形式。对于特殊应用（高精度、安规或高温长期工作），建议与厂方工程师沟通以获得匹配的器件或替代方案。
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