Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FM21X104K201ECG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM21X104K201ECG
- Type
- PSA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM21X104K201ECG
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0257411977
- Electronic Component
- X7R
- Voltage
- 200V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM21X104K201ECG 产品概述
1. 产品简介
FM21X104K201ECG 是一款由 PSA（信昌电陶）生产的贴片多层陶瓷电容（MLCC），具有高可靠性和优异的电气性能。该电容广泛应用于各种电子设备中，特别是在需要高电压和高稳定性的场合。其紧凑的封装尺寸和优异的温度特性使其成为现代电子设计中的理想选择。
2. 主要参数
- 商品分类: 贴片电容（MLCC）
- 容值: 100nF
- 材质（温度系数）: X7R
- 精度: ±10%
- 额定电压: 200V
- 封装: 0805
3. 详细描述
3.1 容值与精度
FM21X104K201ECG 的标称容值为 100nF，精度为 ±10%。这意味着在实际应用中，电容的容值可以在 90nF 到 110nF 之间波动。这种精度适用于大多数通用电子电路，尤其是在对电容值要求不是特别严格的场合。
3.2 材质与温度特性
该电容采用 X7R 材质，具有优异的温度稳定性。X7R 材质的温度系数为 ±15%，在 -55°C 到 +125°C 的温度范围内，电容的容值变化不超过 ±15%。这种特性使得 FM21X104K201ECG 能够在各种环境条件下保持稳定的性能，适用于工业和汽车电子等严苛环境。
3.3 额定电压
FM21X104K201ECG 的额定电压为 200V，这意味着它可以在高达 200V 的电压下稳定工作。这种高电压额定值使其适用于电源滤波、耦合和去耦等高压应用场合。
3.4 封装尺寸
该电容采用 0805 封装，尺寸为 2.0mm x 1.25mm。这种紧凑的封装尺寸使得它非常适合高密度 PCB 设计，尤其是在空间受限的现代电子设备中。
4. 应用领域
FM21X104K201ECG 广泛应用于各种电子设备中，包括但不限于以下领域：
- 电源管理: 用于电源滤波和去耦，确保电源的稳定性和可靠性。
- 通信设备: 用于信号耦合和滤波，提高通信质量。
- 汽车电子: 在汽车电子系统中，用于各种传感器和控制模块，确保系统在严苛环境下的稳定运行。
- 工业控制: 在工业控制系统中，用于各种滤波和耦合应用，提高系统的可靠性和稳定性。
5. 品牌与质量保证
FM21X104K201ECG 由 PSA（信昌电陶）生产，PSA 是一家在电子元器件领域享有盛誉的品牌，以其高质量和可靠性著称。PSA 的产品经过严格的质量控制和测试，确保每一颗电容都能在各种应用场合中表现出色。
6. 总结
FM21X104K201ECG 是一款高性能的贴片多层陶瓷电容，具有 100nF 的容值、±10% 的精度、200V 的额定电压和 X7R 材质的优异温度特性。其紧凑的 0805 封装尺寸使其非常适合现代高密度 PCB 设计。无论是电源管理、通信设备、汽车电子还是工业控制，FM21X104K201ECG 都能提供稳定可靠的性能，是电子设计工程师的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
