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PSA FM18X104K101PBG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM18X104K101PBG
- Type
- PSA
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM18X104K101PBG
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0264820198
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM18X104K101PBG 产品概述
1. 产品简介
FM18X104K101PBG 是一款高性能的贴片多层陶瓷电容器（MLCC），由信昌电陶（PSA）生产。该电容器采用X7R材质，具有优异的温度稳定性和电气性能，广泛应用于各种电子设备中。其容值为100nF，额定电压为100V，精度为±10%，封装形式为0603，适合高密度电路板设计。
2. 主要参数
- 商品分类: 贴片电容（MLCC）
- 容值: 100nF
- 材质（温度系数）: X7R
- 精度: ±10%
- 额定电压: 100V
- 封装: 0603
- 品牌: PSA（信昌电陶）
3. 技术特点
- X7R材质: X7R材质在-55°C至+125°C的温度范围内具有稳定的电容变化率，适用于各种环境条件下的应用。
- 高额定电压: 100V的额定电压使其能够承受较高的电压应力，适用于高压电路设计。
- 高精度: ±10%的精度确保了电容值的稳定性，满足精密电路的需求。
- 小型封装: 0603封装尺寸小，适合高密度电路板设计，节省空间。
4. 应用领域
FM18X104K101PBG 广泛应用于以下领域：
- 消费电子: 如智能手机、平板电脑、笔记本电脑等。
- 工业控制: 如PLC、工业自动化设备等。
- 通信设备: 如基站、路由器、交换机等。
- 汽车电子: 如车载娱乐系统、导航系统等。
- 医疗设备: 如监护仪、诊断设备等。
5. 优势与特点
- 高可靠性: 采用优质材料和先进工艺，确保产品的高可靠性和长寿命。
- 优异的电气性能: 低ESR（等效串联电阻）和低ESL（等效串联电感），提供优异的电气性能。
- 环保合规: 符合RoHS指令，无铅无卤，环保安全。
6. 使用注意事项
- 焊接条件: 建议使用回流焊工艺，焊接温度曲线应符合JEDEC标准。
- 存储条件: 应存放在干燥、无尘的环境中，避免高温和高湿。
- 电气应力: 避免超过额定电压和温度范围使用，以防止损坏。
7. 包装与运输
- 包装形式: 通常采用卷带包装，便于自动化贴装。
- 运输条件: 应避免剧烈震动和冲击，确保产品完好无损。
8. 技术支持与服务
信昌电陶（PSA）提供全面的技术支持和服务，包括产品选型、应用指导、故障分析等，确保客户能够充分发挥产品的性能。
总结
FM18X104K101PBG 是一款高性能的贴片多层陶瓷电容器，具有优异的温度稳定性、高额定电压和高精度，适用于各种电子设备。其小型封装和高可靠性使其成为高密度电路板设计的理想选择。信昌电陶（PSA）提供全面的技术支持和服务，确保客户能够充分发挥产品的性能。
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