WMSIC Electronic Components

PSA FN18N220J500PSG

ModelFN18N220J500PSG
Package0603
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FN18N220J500PSG
Type
PSA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FN18N220J500PSG
Electronic Component
1
Electronic Component
22pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0264820194
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FN18N220J500PSG 贴片多层陶瓷电容(MLCC)产品概述

一、产品核心身份与定位

FN18N220J500PSG是信昌电陶(PSA) 推出的一款0603封装高频稳定型MLCC,针对对容值精度、温度稳定性要求严苛的电子场景设计。该产品兼具小体积、高可靠性与宽温适应性,是消费电子、通信设备、工业控制等领域的通用型基础元件,可替代同类进口电容满足量产需求。

二、关键电气性能参数

该产品的核心电气指标符合高频稳定电容的设计要求:

  1. 容值与精度:标称容值为22pF(型号中“220”代表22×10⁰pF),精度等级为**±5%**(EIA代码“J”),满足多数精密电路的误差控制需求;
  2. 额定电压:直流额定电压为50V,交流应用时需确保峰值电压不超过该值,避免击穿;
  3. 温度系数:采用C0G(EIA代码,对应IEC NP0) 材质,是MLCC中温度稳定性最优的类别——容值随温度变化率<±30ppm/℃(-55℃~125℃范围),且几乎无直流偏置效应(容值不随施加电压衰减);
  4. 损耗特性:典型损耗角正切(tanδ)<0.15%(1kHz测试条件),适合高频信号传输,减少信号损耗与热生成。

三、封装与物理特性

产品采用0603英制贴片封装(对应公制1608,尺寸约1.6mm×0.8mm×0.8mm),属于小型化封装,可有效节省PCB布局空间,适配高密度电路设计。端电极采用无铅锡基合金(符合RoHS环保标准),兼容回流焊、波峰焊等常规贴片工艺,焊接后可靠性良好。

四、温度特性与环境适应性

C0G材质赋予该产品优异的宽温稳定性:

  • 工作温度范围覆盖**-55℃至125℃**,满足工业级、车载级(若符合AEC-Q200可进一步验证)等严苛环境需求;
  • 容值不受温度波动影响,极端温度下仍保持标称值,避免电路性能漂移(如振荡器频率偏移、滤波器截止频率变化);
  • 无直流偏置效应,高电压场景下容值一致性强,确保电路参数稳定。

五、品牌与可靠性保障

信昌电陶(PSA)是国内专注MLCC研发生产的知名厂商,具备完善的质量管控体系:

  • 产品通过高温存储(125℃/1000h)、温度循环(-55℃~125℃/1000次)、湿度循环(85℃/85%RH/1000h) 等可靠性测试,符合行业标准;
  • 产能稳定,可满足中小批量至大规模量产需求,适配电子终端厂商的供应链稳定要求。

六、典型应用场景

因高频稳定、小体积特性,该产品广泛应用于:

  1. 通信设备:手机射频前端(滤波器、耦合器)、通信基站模块(时钟电路、振荡电路);
  2. 消费电子:智能穿戴(传感器滤波)、笔记本电脑(电源滤波、信号耦合);
  3. 工业控制:PLC模块(模拟信号滤波)、电机驱动(EMI滤波);
  4. 精密仪器:示波器、信号发生器等测试设备的高频电路。

七、选型与使用注意事项

  1. 电压匹配:工作电压(直流)≤50V,交流峰值电压≤50V,避免过压击穿;
  2. 温度范围:电路温度需在-55℃~125℃内,超出可能影响性能;
  3. 焊接工艺:回流焊遵循IPC标准(峰值温度240℃~250℃,时间<30s),避免热应力开裂;
  4. 静电防护:生产焊接需佩戴ESD手环,使用防静电工具;
  5. 存储要求:未开封产品存于常温(15℃~35℃)、干燥(湿度<60%)环境,开封后12个月内使用完毕,避免受潮影响焊接。

该产品以高性价比、稳定性能成为高频电路设计的优选元件,可覆盖多数中高端电子设备的基础电容需求。

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