WMSIC Electronic Components

PSA FV31X103K152EEQ

ModelFV31X103K152EEQ
Package1206
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV31X103K152EEQ
Type
PSA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV31X103K152EEQ
Electronic Component
1
Electronic Component
10nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.072g
Electronic Component
1
Electronic Component
BM0264566329
Electronic Component
X7R
Voltage
1.5kV
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV31X103K152EEQ — 10nF ±10% 1.5kV X7R 1206 贴片电容 产品概述

一、产品简介

FV31X103K152EEQ 为 PSA(信昌电陶)出品的高压多层陶瓷贴片电容(MLCC),标称容量 10nF,初始容差 ±10%,额定直流电压 1.5kV,介质材料为 X7R,封装为 1206(约 3.2mm × 1.6mm)。此系列面向高压小型化滤波、耦合/去耦和吸收抑制等应用,兼顾体积、耐压与工艺装配需求。

二、主要性能与特点

  • 高压能力:额定耐压达 1500V DC,满足中高压电源、充电电路及高压脉冲回路的元件要求。
  • X7R 介质:工作温度范围宽(-55°C ~ +125°C),在该温度区间内电容随温度变化受限(典型容差随温度变化不超过 ±15% 的 X7R 性能范围);适用于稳定性要求一般但需温度补偿的场景。
  • 小型封装:1206 体积兼顾空间利用与电压爬电/击穿距离,便于自动贴装与回流焊接。
  • 良好工艺适配性:适用于常规 SMT 贴片与回流工艺,提供带卷带包装,便于高速贴装线使用。

三、电气特性与注意事项

  • 初始容差:±10%,适合一般滤波与旁路用途,不宜用于高精度计时或精密采样回路。
  • 直流偏压效应:X7R 为高介电常数层压陶瓷,施加高电压时会出现显著的直流偏压导致有效电容下降,建议在设计中进行实测评估并预留裕度。
  • 温度与老化:X7R 会有随温度变化和老化引起的容值漂移,重要设计请进行环境与长期稳定性验证。
  • 绝缘与泄漏:在高压应用中要注意印制板爬电距离与绝缘措施,避免沿板表面闪络或污染引发击穿。

四、安装与工艺建议

  • 回流焊:按 JEDEC/IPC 推荐回流曲线进行焊接,最大峰值温度一般为 260°C(具体请参照厂商工艺说明)。
  • 贴装注意:避免在贴片区施加过大机械应力,焊盘尺寸与焊膏量应按封装推荐图配置,防止裂纹或热应力导致失效。
  • 贮存与回潮:按厂商包装要求存放,湿敏等级和具体干燥条件请参考产品出厂说明,必要时回流前进行烘烤处理。

五、典型应用场景

  • 高压开关电源的输入滤波与吸波网络;
  • 脉冲式电源(如升压/反激/飞返)中用于高压滤波或旁路;
  • 医疗和工业高压测量、测试设备的耦合/去耦;
  • 高压整流、静电喷涂与偏压电路中的局部去耦与抑制。

六、可靠性与选型建议

在高压与要求稳定性较高的应用中,建议对样片在实际工作电压、温度范围与频率下进行电容随时间与电压的测量(含 DC bias 特征)。若需承受更高可靠性或更小电容漂移,可考虑并联/串联方案、增加冗余或选用 C0G/NP0 等更稳定但容值/体积受限的介质。选型时同时确认封装机械尺寸与 PCB 布局的爬电距离以满足安全规范。

若需资料手册(数据表)、回流曲线、样品或大货供货信息,请联系 PSA(信昌电陶)授权渠道获取最新技术文档与可靠性测试报告。

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