Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FV43N221J302EFG
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FV43N221J302EFG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FV43N221J302EFG
- Electronic Component
- 1
- Electronic Component
- 220pF
- Package
- 1812
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.21g
- Electronic Component
- 1
- Electronic Component
- BM0264906445
- Electronic Component
- C0G
- Voltage
- 3kV
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FV43N221J302EFG 产品概述
一、产品概述
FV43N221J302EFG 是 PSA（信昌电陶）生产的一款高压贴片多层陶瓷电容（MLCC），额定电压 3kV，标称容量 220pF，容差 ±5%（J），温度系数为 C0G（又称 NP0），封装尺寸为 1812（约 4.5mm × 3.2mm）。该器件针对高压、小体积、低温漂、低损耗的应用场景设计，适合需要高绝缘阻抗和稳定电容值的精密电路。
二、主要技术参数
- 容量：220 pF
- 容差：±5%（J）
- 额定电压：3000 V DC
- 温度系数：C0G（±30 ppm/℃ 典型）
- 封装：1812（4.5 mm × 3.2 mm）贴片型
- 材料：高介电强度多层陶瓷介质
- 品牌：PSA（信昌电陶）
三、产品特点
- 温度稳定性高：C0G（NP0）介质在宽温区间内电容量稳定，适用于高精度滤波和定时电路。
- 耐高压设计：3kV 额定电压满足中高压隔离、测量与整流前端等场景要求。
- 低介质损耗：适合高频应用及高 Q 值需求场合。
- 体积紧凑：1812 封装在提供高耐压的同时兼顾PCB 布局密度。
- 优良的一致性与可靠性：制造过程符合行业检验规范，适合批量生产应用。
四、典型应用场景
- 高压电源滤波与去耦（如高压电源模块、整流后端）
- 高压探测与隔离测量电路（传感器接口、测量放大器输入）
- 高频振荡与定时电路（需要稳定电容值且温漂小的场合）
- 医疗设备、高压气体放电控制、激光驱动等对高压件要求较高的工业设备
五、使用与焊接建议
- 焊接工艺：建议按 IPC/JEDEC 无铅回流曲线执行，峰值温度 ≤ 260°C，液相停留时间控制在 20–40s 内。高压 MLCC 在温度循环下需注意应力释放，推荐合理的焊盘设计与回流曲线以降低热机械应力。
- 设计注意：C0G 型电容在直流偏置下容值变化小，但长期高压工作时仍应考虑适当的电压裕量；关键应用推荐与厂家确认 DC-bias 特性与长期稳定性。
- PCB 布局：为降低裂纹风险，尽量避免在电容边缘附近设置大热膨胀差的铜皮或孔位；采用过孔过度靠近焊盘可能增加机械应力，应参照厂家推荐焊盘尺寸。
六、可靠性与品质控制
PSA 的高压 MLCC 通过多项电气与机械可靠性试验（如耐压测试、温湿循环、振动与冲击测试、焊接热冲击等），并有严格的批次出货检验。高压器件在使用中应关注清洁度、无可见裂纹与合适的储存条件，以确保长期稳定性。
七、包装与订购信息
- 包装形式：常见为卷带（Tape & Reel）以便自动贴片生产；也可按需提供散装或特种包装。
- 订购注意：建议在批量采购前向供应商索取详细样本数据手册（datasheet）与样品进行验证，确认回流曲线、焊盘推荐尺寸及 DC-bias 曲线等关键参数。
如需更详细的电气特性曲线、机械尺寸图或可靠性测试报告，可联系 PSA（信昌电陶）或授权代理获取完整数据表与工程支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
