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PSA FM32X563K631EEG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM32X563K631EEG
- Type
- PSA
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM32X563K631EEG
- Electronic Component
- 1
- Electronic Component
- 56nF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.16g
- Electronic Component
- 1
- Electronic Component
- BM0265313003
- Electronic Component
- X7R
- Voltage
- 630V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM32X563K631EEG 贴片多层陶瓷电容（MLCC）产品概述
一、产品核心定位
FM32X563K631EEG是PSA信昌电陶推出的一款高耐压工业级贴片MLCC，针对高压电路、电源滤波等场景设计，兼顾容量密度、耐压等级与温度稳定性，是替代传统插件电容的高集成度解决方案，适配自动化贴装工艺。
二、关键技术参数解析
- 容值与精度：标称容值56nF（标识为“563”，即56×10³pF），精度±10%，满足多数工业应用对容量偏差的需求（如滤波、耦合电路无需高精度场景）。
- 额定电压：630V直流耐压，属于MLCC高耐压等级（常规产品多为100V-250V），可直接适配AC220V整流后310V高压母线，裕量充足。
- 温度系数：X7R介电材料，温度范围覆盖**-55℃至+125℃**，容量变化≤±15%，在宽温环境下保持性能稳定，适合户外、车载等温度波动场景。
三、封装与物理特性
采用1210英制贴片封装（对应公制3.2mm×2.5mm），符合表面贴装工艺要求，支持自动化贴装，适配高密度电路板设计。典型物理尺寸：
- 长度：3.2±0.2mm
- 宽度：2.5±0.2mm
- 厚度：0.8±0.1mm
电极镀层为镍-锡（Ni/Sn），兼容无铅回流焊工艺，符合RoHS环保标准，无铅无卤。
四、材料特性与可靠性
X7R介电陶瓷为铁电材料，介电常数（εr）达2000-4000，能在1210小封装下实现56nF高容量（对比COG材料，介电常数仅10-100，相同封装容量不足1nF）。产品通过多项可靠性测试：
- 高温寿命：125℃下10000小时，容量变化≤±10%，漏电流≤1μA；
- 温度冲击：-55℃至+125℃循环100次，无开裂、容量衰减；
- 耐压测试：720V（1.15倍额定电压）持续1分钟，无击穿。
五、典型应用场景
因高耐压、宽温稳定的特性，适配以下场景：
- 高压电源滤波：开关电源、LED驱动电源的高压侧滤波（滤除AC220V整流后母线纹波）；
- 工业控制设备：PLC、变频器、伺服驱动器的高压模块（支撑电路稳定性）；
- 车载电子：车载充电桩（DC快充高压母线）、车载高压传感器（宽温环境）；
- 医疗设备：监护仪、小型诊断设备的辅助高压电路（要求可靠性）；
- 照明系统：大功率LED路灯、工矿灯的驱动电源（适配AC220V输入）。
六、品牌与质量保障
PSA信昌电陶是国内专注MLCC研发的高新技术企业，产品通过ISO9001质量体系认证、IATF16949汽车级认证，符合欧盟RoHS、REACH环保标准。每批次产品经全参数检测，确保一致性与供应链稳定性，为客户提供可靠的高压电容解决方案。
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