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PSA FM32N103J251EFG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM32N103J251EFG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM32N103J251EFG
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.117g
- Electronic Component
- 1
- Electronic Component
- BM0259484904
- Electronic Component
- C0G
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM32N103J251EFG 产品概述
一、产品简介
FM32N103J251EFG 为 PSA（信昌电陶）推出的贴片多层陶瓷电容（MLCC），标称容量 10nF（103），精度 ±5%（J），额定电压 250VDC，温度系数为 C0G/NP0，封装规格为 1210（约 3.05mm × 2.54mm）。该系列以温度稳定性好、损耗低、频率特性优异著称，适用于对电容稳定性和线性度有较高要求的电路。
二、主要性能特点
- C0G/NP0 陶瓷介质，温度系数接近 0ppm/°C（典型±30ppm/°C 量级），温度稳定性优秀；
- 容量随直流偏压变化极小（相比 X7R、X5R 等介质），适合高精度滤波与定时电路；
- 介质损耗与介电吸收低，高 Q 值，适合高频及射频应用；
- 额定电压 250V，适用于较高电压的耦合、滤波场合；
- 采用 1210 大封装，具有较好电流承载能力和热稳定性，便于自动贴装。
三、典型电气参数（建议以厂商数据为准）
- 标称容量：10nF（103）
- 容差：±5%（J）
- 额定电压：250V DC
- 工作温度范围：常见 -55℃ ~ +125℃（具体请参照厂商规格书）
- 温度系数：C0G/NP0（接近 0ppm/℃）
- 损耗与绝缘特性：介质损耗率低、绝缘电阻高、介电吸收小
四、典型应用场景
- 精密模拟前端、A/D 转换器旁路与采样电容；
- 高频滤波、匹配与谐振电路（RF、电感耦合回路）；
- 定时、振荡器与相位噪声敏感电路；
- 工业控制、仪器仪表及通信设备中对容量稳定性要求高的场合。
五、设计与焊接注意事项
- 兼容无铅回流焊工艺，建议遵循制造商的回流温度曲线（峰值温度按照组件说明）；避免重复过热与急冷；
- 封装较大，贴装时关注焊盘设计与焊膏用量以保证焊接可靠性；
- 避免在 PCB 上产生过大的机械应力或弯曲；组件不作为高压隔离（非安全级电容），不可用于跨线 mains 抗干扰替代用途；
- 对于高精度应用，建议在实际工作电压和温度下进行电容值和偏置测试验证。
六、可靠性与质量保证
PSA（信昌电陶）产品通常经过出厂电气测试与外观检验，并按行业规范进行抽样可靠性试验。产品符合 RoHS 要求，采用适合贴片生产线的卷带/盘装方式，便于 SMT 自动化生产。建议在设计初期获取并参考厂商完整规格书和可靠性报告以满足特殊应用的资格认证需求。
七、包装与订购建议
FM32N103J251EFG 常见为卷带（Tape & Reel）包装，适配自动贴片机。订购时请确认容量、容差、额定电压、封装与包装数量（如每卷数量），并索取最新规格书以确保器件在目标应用中的性能满足要求。
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