Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FM32X474K101EGG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM32X474K101EGG
- Type
- PSA
- Minimum package
- 1000 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM32X474K101EGG
- Electronic Component
- 1
- Electronic Component
- 470nF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.164g
- Electronic Component
- 1
- Electronic Component
- BM0106504469
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM32X474K101EGG 产品概述
1. 基础信息
FM32X474K101EGG 是一款高品质的多层陶瓷电容（MLCC），由知名品牌 PSA（信昌电陶）生产。该电容器的参数为 100V，电容值为 470nF，电压容差为 ±10%，介质类型为 X7R，封装尺寸为 1210（即 3.2mm x 2.5mm）。
2. 关键规格
- 电压等级： 100V DC
- 电容量： 470nF
- 电压容差： ±10%
- 介质特性： X7R
- 封装类型： 1210（一般适用于表面贴装技术）
- 品牌： PSA（信昌电陶）
3. 产品特性
- 多层陶瓷结构：这款电容器采用多层陶瓷材料制造，具有优良的电气特性和温度稳定性。多层设计允许更小的体积实现更高的电容量，是现代电子设备中常用的选择。
- 高频特性：由于其优越的高频响应，FM32X474K101EGG 电容器在高频电路中表现出色，适合用于开关电源、滤波和耦合等应用。
- 温度特性：X7R 介质材料的温度范围为 -55℃ 至 +125℃，在此温度范围内，电容值的变化率相对较小，这使得产品在不同工作环境中均能保持较为稳定的性能。
- 低等效串联电阻（ESR）：该电容器具有较低的等效串联电阻，能够在较高的电流条件下降低功率损耗，同时提高电路的整体效率。
4. 应用场景
FM32X474K101EGG 可广泛应用于多种电子设备和电路中，尤其是在需要稳定电容值及高频特性的场合。其主要应用领域包括但不限于：
- 移相电路和耦合电路：适用于音频设备的信号耦合和解耦。
- 开关电源：在 DC-DC 转换器和 AC-DC 适配器中作为输出平滑电容，提供低 ripple 的电源。
- 滤波器设计：在滤波电路中用于去除不必要的高频噪声。
- 高频信号处理：如无线电通信系统、射频电路及其它射频应用。
5. 产品优势
- 无需维护：多层陶瓷电容具有良好的可靠性，不需要定期维护，减少了后期的维修成本。
- 小型化设计：1210 封装使得电容器体积小巧，节省了电路板的空间，尤其适合于移动设备和小型电子产品。
- 稳定性高：由于采用X7R介质，电容的性能在长时间使用中保持良好的稳定性，符合现代电子设备对长期工作的要求。
6. 存储与处理
在使用和存储 FM32X474K101EGG 产品时，应注意干燥和防静电，以避免对电容器造成损害。尽管该产品具有良好的耐环境性，用户仍需避免在极端温度和潮湿条件下长期存放。
7. 结论
FM32X474K101EGG 是一款性能卓越、可靠性高的多层陶瓷电容器，非常适合现代电子设备中各种应用需求。凭借其高电压、高容量、小尺寸和优良的高频特性，该电容器无疑是优化电路设计、提升性能的理想选择。
了解更多关于这一产品的详细信息，可以访问 PSA（信昌电陶） 官方网站或参考相关产品手册，以确保选用符合特定应用需求的电容器。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
