Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FV43X472K202EFG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FV43X472K202EFG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FV43X472K202EFG
- Electronic Component
- 1
- Electronic Component
- 4.7nF
- Package
- 1812
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.237g
- Electronic Component
- 1
- Electronic Component
- BM0264820260
- Electronic Component
- X7R
- Voltage
- 2kV
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FV43X472K202EFG 产品概述
一、基本信息
FV43X472K202EFG 为 PSA（信昌电陶）系列高压贴片多层陶瓷电容（MLCC），额定电压 2 kV，标称电容 4.7 nF，容差 ±10%（K），温度特性 X7R，封装规格 1812（常见尺寸约 4.5 × 3.2 mm）。该器件为表面贴装结构，适用于需要高工作电压与中等容值的电源与高压信号场合。
二、主要特性
- 高压额定：2 kV，适合中高压电路使用。
- 容值与精度：4.7 nF，±10%（K）用于一般滤波、耦合与缓冲。
- 温度特性：X7R（-55°C 至 +125°C，电容变化典型值在 ±15% 范围内），属类 II 电介质，体积容积比高、成本效益好。
- 封装：1812 尺寸便于手工与自动贴装，适中体积有利于耐压与散热。
- 低寄生电阻与电感，适合一般高频滤波与去耦场合（注意 X7R 相较 C0G/NP0 损耗与漂移较大）。
三、电气性能与注意点
- X7R 为高介电常数材料，在体积受限时可获得较大容量，但存在明显的直流偏压（DC bias）效应：在接近额定电压时，有效电容会下降，设计时需以实测或厂方曲线为准。
- 温度稳定性中等，不适合作为精密计时或高精度电容基准。
- 高频损耗与介质吸收高于 NPO 型，电路设计时需评估损耗与相位影响。
四、典型应用
- 高压电源滤波与旁路（如高压直流链路、电子变压器输入）
- 高压耦合/隔直与脉冲电路（脉冲滤波、抑制尖峰）
- 高压分压器/测试设备中做滤波或旁路元件
- 工业、电力电子、仪器仪表与科研装置等需耐高压的场合
五、选型与设计建议
- 对于要求精确容量或低温漂的电路，优先考虑 C0G/NP0，X7R 适用于容差与温漂要求不高但需高容值的场景。
- 考虑 DC bias：若电路在高静态电压下工作，应参考厂商在不同偏压下的电容保持率曲线，必要时选用更大标称值或并联多只。
- 考虑电压余量与长期可靠性，关键应用可采用额定电压的去额定策略（即工作电压低于最大额定值）。
六、装配与可靠性要点
- 贴装：遵循厂家推荐回流焊曲线，避免过高峰值温度与反复重流；1812 为相对较大尺寸，注意焊接冷却速度与预热阶段以减少热冲击。
- 机械应力：避免在焊接后对焊盘或电容施加过大的弯曲或冲击，合理的焊盘与过孔设计、适当的圆角可降低裂纹风险。
- 存储：防潮防尘，长期存放按生产商建议进行干燥保管以防吸湿影响焊接质量与可靠性。
七、采购与替代
- 订购时请确认完整料号与规格（容量、容差、额定电压、温度特性、封装及包装方式）。
- 若需替代，选择时需匹配额定电压与等效或更高的电压余量、相近温度特性与封装尺寸，并考虑 DC bias 与频率特性差异对系统的影响。
如需更具体的电气参数曲线（DC bias、温漂曲线、等效串联参数 ESR/ESL、耐压测试数据）、推荐回流焊曲线或封装图纸，可提供进一步信息以便查验厂方数据手册并给出精确建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
