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PSA FV43N331J302EFG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FV43N331J302EFG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FV43N331J302EFG
- Electronic Component
- 1
- Electronic Component
- 330pF
- Package
- 1812
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.205g
- Electronic Component
- 1
- Electronic Component
- BM0264906448
- Electronic Component
- C0G
- Voltage
- 3kV
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FV43N331J302EFG 产品概述
一、产品简介
FV43N331J302EFG 是 PSA（信昌电陶）系列的一款高压贴片多层陶瓷电容（MLCC），规格为 1812 封装，标称容值 330 pF，精度 ±5%，额定电压 3 kV，温度系数为 C0G（又称 NP0）。该型号针对需要高绝缘耐压、低温漂与低介质损耗的高可靠性应用设计，兼顾体积与耐压能力，适用于中高压直流与射频、滤波、谐振等电路。
二、主要电气参数
- 标称容值：330 pF
- 精度：±5%
- 额定电压：3 kV（DC）
- 温度系数：C0G / NP0（极低温漂、线性好）
- 封装：1812（尺寸等级，适配常见 SMT 工艺）
- 类型：贴片陶瓷电容（MLCC）
三、关键特性
- 温度稳定性高：C0G 材料在宽温区间内容值变化极小，适合精密滤波与时间常数电路。
- 低介质损耗：有利于高 Q 值和射频特性，适用于高频与谐振应用。
- 高耐压等级：3 kV 额定电压满足绝缘与高压旁路、阻尼、隔离电容需求。
- 机械与热稳定良好：1812 封装在焊接与振动环境下表现稳健，便于自动化贴装。
四、典型应用场景
- 高压电源滤波与旁路（DC 链路、偏置网络）
- 高压探测、测量与分压电路中的耦合/滤波元件
- 射频与高 Q 谐振电路（需低损耗、低温漂）
- 工业控制、高压测试设备与医疗设备中的高压容性元件
五、选型与使用建议
- 若电路存在宽温范围或高精度要求，优先选择 C0G（NP0）材料以保证容值稳定性。
- 对于直流高压环境，考虑适当的电压裕量与爬电距离设计，必要时采取多级分压或串联电容并配平阻。
- 注意直流偏置效应：虽然 C0G 的 DC 偏置影响很小，但在极高电场下仍建议实测确认实际容值。
- 机械应力控制：贴片在 1812 尺寸下抗机械性较好，但在波峰/回流焊前后避免弯曲或过度振动，防止裂纹。
六、封装、焊接与储存
- 封装为标准 SMT 1812，适配常见贴片设备；推荐参照厂商推荐的焊盘尺寸与回流温度曲线进行工艺设计。
- 焊接时采用规范回流工艺并做好预热与缓冷，避免热冲击导致元件裂纹。
- 储存建议干燥包装（密封防潮），长期存放应避免潮湿与强光直射，出厂后尽量在规定有效期内使用。
七、可靠性与检验
- C0G MLCC 在温度循环、湿热与高压耐压测试中表现优良，但在装配后建议进行抽样电气性能与外观检查（容值、绝缘电阻、耐压测试）。
- 对关键应用可要求厂方提供电气特性曲线（温度-容值、频率响应、介质损耗）及可靠性测试报告（温循环、振动、焊接耐受性）。
如需更详细的电气曲线、封装尺寸图或推荐焊盘布局，请联系供应商获取完整数据手册和样片以便验证在具体应用中的行为。
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