WMSIC Electronic Components

PSA FV55X103K302EGG

ModelFV55X103K302EGG
Package2220
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV55X103K302EGG
Type
PSA
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV55X103K302EGG
Electronic Component
1
Electronic Component
10nF
Package
2220
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.54g
Electronic Component
1
Electronic Component
BM0257411980
Electronic Component
X7R
Voltage
3kV
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV55X103K302EGG 产品概述

一 产品简介

FV55X103K302EGG 为 PSA(信昌电陶)出品的一款高压片式多层陶瓷电容器(MLCC)。标称容量为 10 nF,初始容差 ±10%,额定直流电压 3 kV,介质型号 X7R,适用于需要中等容量、较高耐压与体积比的高压电子电路。该器件以 2220 封装提供,适合自动贴装生产与大电压环境的应用。

二 主要参数与特性

  • 容量:10 nF(0.01 μF)
  • 容差:±10%
  • 额定电压:3 kV DC
  • 介质:X7R(工作温度范围 -55 ℃ 至 +125 ℃,随温度变化电容量典型范围 ±15%)
  • 封装:2220(近似尺寸 5.7 mm × 5.0 mm)
  • 特点:体积比高、耐压强、介质损耗低、寄生电感低、适合高压滤波与去耦

三 结构与封装说明

2220 为较大尺寸的片式封装,内部为多层厚度控制的陶瓷介质与内电极堆叠结构。此类大尺寸高压 MLCC 为了保证耐压通常采用较厚外层介质与优良端电极处理。产品常以卷带(reel)供货,便于贴装与自动化生产。

四 典型应用场景

  • 高压直流电源(HV DC)滤波与去耦
  • 脉冲电路、脉冲整形与吸收网络
  • 医疗及工业高压供电模块
  • 高压测量与高压驱动电路的阻尼/旁路 注意:若用于涉及电网安全隔离的场合(X/Y 安全电容要求),应选用具备相应认证的安全电容器件,本品为一般工业高压 MLCC,不替代安全类元件。

五 选型建议与注意事项

  • DC 偏压效应:陶瓷电容(尤其 X7R)在高偏压下会出现显著电容下降,建议在设计时留有裕量(视具体电压-电容曲线而定),必要时参考厂商数据或做样件测试。
  • 温度与频率响应:X7R 在高低温或高频时电容有变化,若需严格稳定的容值推荐选用 C0G/NP0 系列,但其体积与耐压比 X7R 不占优势。
  • 额定电压下的瞬态与脉冲能力需向厂商确认脉冲承受能力与电击穿裕度。
  • 对于关键应用建议进行样机测试,包括温度循环、湿热、耐压与长期电气老化试验。

六 可靠性与焊接建议

  • 焊接:推荐采用符合厂商推荐的回流曲线,避免过长高温或机械应力集中;在贴片过程中应注意吸取头与贴装压力以防裂片。
  • 机械应力:大尺寸 MLCC 对 PCB 弯曲较敏感,布线与固定时应避免基板弯曲与点应力集中。
  • 清洗:尽量使用对陶瓷安全的清洗工艺,避免强酸碱或长时间浸泡。
  • 环保与合规:常见为无铅焊接兼容件(以出货批次与证书为准),可向供应商索取 RoHS 等合规性文件。

七 订购与包装信息

型号 FV55X103K302EGG 常以卷带包装供应,便于 SMT 贴装。订购时请确认批次、物料编号、最小订购量及是否需要额外的测试报告(如 Hi-Pot、偏压电容曲线)。如需在极端环境或关键可靠性项目中使用,建议向 PSA 索取完整数据手册与加速寿命试验数据以供评估。

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