Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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FV32N102J202EFG 是一款高性能的贴片多层陶瓷电容(MLCC),由信昌电陶(PSA)公司生产。该电容采用C0G(NP0)材质,具有优异的温度稳定性和高频特性,适用于高精度、高可靠性的电子电路。其容值为1nF,精度为±5%,额定电压高达2kV,封装尺寸为1210,广泛应用于工业、通信、医疗和汽车电子等领域。
容值:1nF
该电容的标称容值为1纳法拉(nF),适用于需要精确电容值的电路设计。
材质(温度系数):C0G(NP0)
C0G材质是一种具有极低温度系数的陶瓷材料,其温度稳定性极佳,在-55°C至+125°C的温度范围内,电容值变化极小(通常为±30ppm/°C)。这使得FV32N102J202EFG非常适合用于对温度变化敏感的高精度电路。
精度:±5%
该电容的容值精度为±5%,能够满足大多数高精度电路设计的需求。
额定电压:2kV
FV32N102J202EFG的额定电压为2千伏(kV),能够承受较高的电压应力,适用于高压环境下的电路设计。
封装:1210
该电容采用1210封装,尺寸为3.2mm x 2.5mm,适合高密度PCB布局,同时提供良好的机械强度和焊接可靠性。
FV32N102J202EFG 由于其高电压、高精度和优异的温度稳定性,广泛应用于以下领域:
在设计电路时,选择FV32N102J202EFG 电容时需考虑以下因素:
信昌电陶(PSA)作为全球知名的电子元器件制造商,以其高质量和可靠性著称。FV32N102J202EFG 电容经过严格的质量控制和测试,确保其在各种应用环境下的稳定性和可靠性。PSA公司还提供完善的技术支持和售后服务,帮助客户解决设计和应用中的问题。
FV32N102J202EFG 是一款高性能的贴片多层陶瓷电容,具有1nF的容值、±5%的精度、2kV的额定电压和C0G材质的优异温度稳定性。其1210封装适合高密度PCB布局,广泛应用于工业、通信、医疗、汽车电子和消费电子等领域。信昌电陶(PSA)的品牌保证和严格的质量控制,使得该电容成为高精度、高可靠性电路设计的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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