WMSIC Electronic Components

PSA FS43X105K101EFG

ModelFS43X105K101EFG
Package1812
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FS43X105K101EFG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FS43X105K101EFG
Electronic Component
1
Electronic Component
1uF
Package
1812
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.237g
Electronic Component
1
Electronic Component
BM0264820251
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FS43X105K101EFG 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本定位

FS43X105K101EFG是PSA信昌电陶推出的通用型贴片多层陶瓷电容(MLCC),采用1812封装,核心参数覆盖中高压、中等容值场景,适配工业控制、电源滤波等多类电子系统需求,属于X7R温度特性材质的高可靠性电容产品。

二、核心技术参数详解

该型号电容的关键参数可满足多数中低压电子设备的基础需求,具体如下:

  1. 容值与精度:标称容值为1μF(即10⁵ pF),精度±10%,在常规工业级电子系统中可覆盖滤波、耦合等对容值精度要求不苛刻的场景;
  2. 额定电压:直流额定电压为100V,是该型号的核心电压参数,可适配输入/输出电压≤100V的电源模块、控制电路;
  3. 温度特性:采用X7R陶瓷材质,温度范围为-55℃~+125℃,容值变化率控制在±15%以内,相比Y5V等材质,温度稳定性显著提升,适合宽温环境应用;
  4. 辅助参数:绝缘电阻≥10⁹ Ω(25℃、100V直流下),损耗角正切(tanδ)≤1%(1kHz下),满足信号传输与电源滤波的低损耗要求。

三、封装与制造工艺

  1. 封装规格:采用1812英制封装(公制尺寸4.5mm×3.0mm),符合国际电子封装标准,适配常规贴装生产线(SMT),焊盘设计需匹配IPC标准以保证焊接可靠性;
  2. 制造工艺:基于多层陶瓷叠层技术(MLCC核心工艺),采用钛酸钡基X7R陶瓷介质,叠层过程中使用镍基贱金属电极(BMEC),既降低成本又提升耐温性;产品经高温烧结、电极涂覆、封装测试等多道工序,保证一致性与可靠性。

四、典型应用场景

FS43X105K101EFG的参数特性使其适配以下场景:

  1. 电源滤波:中低压开关电源(如12V/24V输出电源)的输出滤波、母线滤波,1μF容值可有效抑制高频纹波;
  2. 工业控制电路:PLC、伺服驱动器等设备的信号耦合、去耦电容,宽温范围适配工业现场环境;
  3. 通信设备:路由器、交换机等设备的电源模块滤波,低损耗特性保证信号传输质量;
  4. 消费电子高端应用:4K显示器、机顶盒等产品的电源电路,满足中高压滤波需求;
  5. 小型储能电路:低功率UPS、应急照明的辅助储能,X7R材质的稳定性适合长期工作。

五、品牌与可靠性优势

PSA信昌电陶作为国内MLCC领域的主流厂商,该型号具备以下优势:

  1. 环保合规:符合RoHS 2.0、REACH等国际环保标准,无铅无镉,适配绿色电子设计;
  2. 可靠性测试:通过温度循环(-55℃~+125℃,1000次)、湿度负荷(85℃/85%RH,1000h)、耐电压(1.5倍额定电压,1s)等测试,失效率低;
  3. 产能稳定:具备规模化生产能力,可满足批量采购需求,交货周期可控。

六、选型与使用注意事项

  1. 电压降额:直流应用建议降额至额定电压的80%以下(即≤80V),交流应用需计算峰值电压(≤70V峰值),避免击穿;
  2. 直流偏置影响:X7R材质在直流偏置下容值会下降(100V偏置时约降15%),选型时需根据实际偏置电压调整容值余量;
  3. 焊接工艺:采用回流焊工艺,温度曲线需符合MLCC焊接要求(峰值温度≤245℃,时间≤10s),避免热应力损坏;
  4. PCB设计:焊盘尺寸需匹配1812封装(建议焊盘长3.23.5mm,宽1.82.0mm),间距合理,避免短路或立碑。

该型号电容凭借平衡的性能参数与可靠性,成为中高压电子系统中通用滤波、耦合的优选元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.