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PSA FM55X474K501EFG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM55X474K501EFG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM55X474K501EFG
- Electronic Component
- 1
- Electronic Component
- 470nF
- Package
- 2220
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.379g
- Electronic Component
- 1
- Electronic Component
- BM0264820203
- Electronic Component
- X7R
- Voltage
- 500V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM55X474K501EFG 产品概述
一、产品简介
FM55X474K501EFG 是信昌电陶（PSA）生产的一款高压贴片多层陶瓷电容（MLCC），标称容量 470nF（0.47µF），初始容差 ±10%，额定直流电压 500V，介质类型 X7R，封装规格 2220。该型号在重量、体积与耐压之间取得平衡，适用于需要中等容量与较高工作电压的表面贴装场合。
二、主要电气参数
- 容值：470nF（0.47µF）
- 公差：±10%（K）
- 额定电压：500V DC
- 介质：X7R（工作温度范围典型为 −55°C 至 +125°C，按X7R标准随温度的电容量变化可达数百分比）
- 封装：2220（用于高压与较大电荷存储场合的片式封装）
- 其它：MLCC 具有低等效串联电阻（ESR）和低等效串联电感（ESL），适合高频旁路与抑制脉冲噪声
三、性能特点
- 高耐压：500V 额定电压，适合工业级电源与高压电路应用。
- 中等容量：0.47µF 在滤波、耦合与能量瞬间释放方面表现均衡。
- X7R 介质：在较宽温度范围内保持良好容量密度，体积小于同等电压的电解或薄膜电容。
- 贴片化设计：兼容常规回流焊工艺，利于自动化组装和高密度布板。
- 低 ESR/ESL：能够承受较高的纹波电流与快速脉冲，适合开关电源旁路和吸收器件。
四、典型应用场景
- 开关电源（高压侧）滤波与旁路
- 高频脉冲能量回收/储能（如闪光、激励电路）
- 脉冲阻尼与吸收（Snubber）电路
- 工业控制与测量设备的高压耦合/去耦
- LED 驱动、电源模块与逆变器中的高压滤波
五、选型与使用建议
- DC 偏压效应：X7R 类陶瓷电容在直流偏压下会出现显著电容下降，应在设计时考虑电压工作点后的实际有效电容，必要时对电容留余量或做实测验证。
- 温度与老化：X7R 在温度变化和长期使用中有一定漂移与老化，若电路对精度要求高，建议选用 NP0/C0G 或薄膜电容。
- 焊接与布局：采用推荐的焊盘设计并遵循厂家回流焊温度曲线，避免因底板应力导致电容裂纹；两端焊接均匀，避免机械应力集中。
- 可靠性验证：在关键应用（高压、冲击、汽车类）建议进行样件老化、冲击振动与耐压测试，并索取厂家完整规格书与检测报告。
六、采购与技术支持
FM55X474K501EFG 由 PSA（信昌电陶）提供。如需样品、详细规格书（包括温度特性曲线、DC 偏压特性、ESR/DF 数据）或大批量供货信息，请联系信昌电陶或授权分销商获取最新技术资料与质量认证。
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