WMSIC Electronic Components

PSA FM43X683K631EFG

ModelFM43X683K631EFG
Package1812
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FM43X683K631EFG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FM43X683K631EFG
Electronic Component
1
Electronic Component
68nF
Package
1812
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.229g
Electronic Component
1
Electronic Component
BM0264820238
Electronic Component
X7R
Voltage
630V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FM43X683K631EFG 产品概述

1. 产品简介

FM43X683K631EFG 是一款高性能的贴片多层陶瓷电容(MLCC),由信昌电陶(PSA)公司生产。该电容具有68nF的容值,采用X7R材质,具备优异的温度稳定性和电气性能。其额定电压为630V,精度为±10%,封装形式为1812,适用于高电压、高可靠性的电子电路。

2. 关键特性

  • 容值: 68nF
  • 材质: X7R
  • 精度: ±10%
  • 额定电压: 630V
  • 封装: 1812
  • 温度系数: X7R(-55°C至+125°C,容值变化±15%)

3. 应用领域

FM43X683K631EFG 广泛应用于各种高电压、高可靠性的电子设备中,包括但不限于:

  • 电源管理: 用于滤波、去耦和储能,确保电源的稳定性和可靠性。
  • 工业控制: 在工业自动化设备中,用于信号处理和电路保护。
  • 汽车电子: 在汽车电子系统中,用于发动机控制、安全系统和信息娱乐系统。
  • 通信设备: 在基站、路由器和交换机中,用于信号滤波和电路保护。

4. 技术优势

  • 高电压能力: 630V的额定电压使其适用于高电压应用,提供更高的安全裕度。
  • 温度稳定性: X7R材质在宽温度范围内保持稳定的容值,确保设备在各种环境下的可靠性。
  • 高精度: ±10%的精度满足大多数应用的需求,提供一致的性能。
  • 紧凑封装: 1812封装尺寸适中,便于在紧凑的电路板上布局。

5. 设计与制造

FM43X683K631EFG 采用先进的陶瓷材料和多层结构设计,确保其在高电压和高温度环境下的稳定性和可靠性。信昌电陶(PSA)公司拥有严格的质量控制体系,确保每一颗电容都符合高标准的质量要求。

6. 环境与可靠性

  • 温度范围: -55°C至+125°C
  • 湿度: 符合JEDEC标准
  • 可靠性测试: 通过严格的寿命测试和可靠性测试,确保产品在各种恶劣环境下的长期稳定性。

7. 订购信息

  • 型号: FM43X683K631EFG
  • 品牌: PSA(信昌电陶)
  • 封装: 1812
  • 包装: 标准卷带包装,便于自动化贴装

8. 结论

FM43X683K631EFG 是一款高性能、高可靠性的贴片多层陶瓷电容,适用于各种高电压、高可靠性的电子设备。其优异的温度稳定性、高电压能力和紧凑封装使其成为工程师在设计高可靠性电路时的理想选择。信昌电陶(PSA)公司以其严格的质量控制和先进的技术,确保每一颗电容都满足客户的高标准需求。

通过以上概述,可以看出FM43X683K631EFG在电子元器件市场中的竞争优势和广泛应用前景。无论是在工业控制、汽车电子还是通信设备中,FM43X683K631EFG都能提供稳定可靠的性能,满足各种复杂应用的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.