WMSIC Electronic Components

PSA FV55X104K202EGG

ModelFV55X104K202EGG
Package2220
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV55X104K202EGG
Type
PSA
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV55X104K202EGG
Electronic Component
1
Electronic Component
100nF
Package
2220
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.56g
Electronic Component
1
Electronic Component
BM0257412001
Electronic Component
X7R
Voltage
2kV
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV55X104K202EGG 产品概述

一、产品简介

FV55X104K202EGG 为信昌电陶(PSA)推出的一款高压贴片多层陶瓷电容(MLCC),标称容量 100nF(0.1µF),容差 ±10%,额定电压 2kV,介质材料为 X7R,封装规格为 2220。该器件面向中高压供电回路的去耦、耦合与旁路应用,在耐压和体积之间提供良好平衡。

二、主要规格与特性

  • 容量:100nF(0.1µF)
  • 精度:±10%
  • 额定电压:2000V DC
  • 介质:X7R(温度系数,-55°C 至 +125°C)
  • 封装:2220(常见尺寸约 5.6 × 5.0 mm,具体以厂方规格为准)
  • 品牌:PSA(信昌电陶)
  • 包装:常见卷带盘装,便于贴片生产线使用

主要特性:高工作电压、较大容量与紧凑封装、温度稳定性良好(属于 II 类陶瓷)、适合一般用途的高压去耦与耦合场合。

三、应用场景

  • 高压电源滤波与旁路(DC-DC、HV 供电模块)
  • 耦合/隔直(高压信号耦合、探测电路)
  • 工业与测试设备(耐压要求高的测量与控制回路)
  • 医疗与科研高压系统(注意系统认证与设计规范)
  • 射频/脉冲场合的去耦(需验证脉冲电流能力)

四、选型与使用注意

  • DC 偏压下电容量会下降:X7R 在高直流偏置下可能出现显著容量降低,实际电路中应用测量验证,必要时选择更大容量或并联方案。
  • 安全裕度:长时间可靠性建议根据用途适当降额(视工作环境与冲击情况可采用 50%~80% 的降额策略),以降低破裂与击穿风险。
  • 焊接与装配:遵循厂方回流焊曲线,避免强烈机械应力(焊接后 PCB 弯曲、压装会导致裂纹);推荐使用应力缓解的焊盘设计与充足焊膏量。
  • 清洗与处理:避免在清洗或折弯过程中产生应力;高压应用建议使用目视/电测检查焊点完整性。
  • 温度范围:X7R 适用于 -55°C 至 +125°C,但高温下电容量可能漂移。

五、可靠性与规范

FV55X104K202EGG 属于 MLCC 常见系列,制造过程需满足材料一致性与烧结控制,常见失效模式为机械裂纹与电击穿。建议在关键应用中进行样件老化试验、温度循环与耐压测试。若需符合特殊认证(如医疗、航空),请向厂商索取相关资格与检测报告。

六、采购与封装建议

订购时请确认完整料号与包装要求(卷带长度、盘装直径等)。在设计 PCB 时预留足够焊盘与贴装余量,适当考虑防裂设计(减少铜箔应力集中)。如需替换或并联使用,请注意等效 ESR、ESL 与体积约束对电路性能的影响。

总结:FV55X104K202EGG 提供了在 2220 封装下的 2kV 等级与 100nF 容量组合,适合对耐压有较高要求但又需较大电容量的中高压应用。选型时应关注直流偏压下的容量变化与机械应力管理,以确保长期可靠运行。若需具体电气参数曲线与封装图纸,建议索取厂家数据手册。

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