Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FM43N473J631EHG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM43N473J631EHG
- Type
- PSA
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM43N473J631EHG
- Electronic Component
- 1
- Electronic Component
- 47nF
- Package
- 1812
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.314g
- Electronic Component
- 1
- Electronic Component
- BM0264906452
- Electronic Component
- C0G
- Voltage
- 630V
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM43N473J631EHG 产品概述
一、产品概况
FM43N473J631EHG 为 PSA（信昌电陶）生产的贴片多层陶瓷电容（MLCC），标称容量 47nF（473），容差 ±5%（J），额定电压 630VDC，温度特性 C0G（等同 NP0），封装 1812（约 4.57 × 3.05 mm）。该型号以高耐压、低损耗、温度稳定性好著称，适用于对精度与长期稳定性要求较高的电路。
二、主要电气机械特性
- 容值：47nF ±5%
- 额定电压：630VDC
- 温度特性：C0G（温漂极小，典型约 ±30 ppm/°C）
- 封装：1812（SMD，约 4.57 × 3.05 mm）
- 介质损耗与介电吸收低，Q 值高，适合高频和精密应用
- 耐压与绝缘性能优良，适合中高压直流场合
三、典型应用场景
- 高压直流耦合/隔离电容
- 精密滤波与定时电路（振荡器、参考网络）
- 开关电源与功率电子中的缓冲/吸收电容（需评估冲击电压）
- 高频滤波、匹配与谐振回路
- 航空、仪表与工业控制等对温度稳定性要求高的场合
四、封装与可靠性建议
- 1812 尺寸便于自动贴装，适配常规回流焊工艺
- C0G 型电容在宽温区间（典型 -55°C 至 +125°C）保持优良性能，但在高偏压或高温长期工作时建议做老化/样件验证
- 设计时建议在高应力（高偏压/高温/高电场）环境下采取适当降额或进行试验验证，以提高可靠性
五、焊接与使用注意
- 按供应商推荐的回流焊曲线与 IPC/JEDEC 标准进行焊接，避免超温或过长高温暴露
- 存储与装配时避免机械应力（弯曲、挤压）以防裂纹
- 在高压脉冲或瞬态存在时，应评估能量吸收能力并考虑并联或串联设计以分散应力
六、订购与替代
- 常备卷带包装，适合贴片生产线。订购时确认完整料号与包装规格
- 选型时可参考同类 C0G 高压 47nF / 630V 的 MLCC，注意尺寸、额定电压与长期可靠性匹配
如需该型号的详细电气参数曲线、回流焊曲线或样品测试结果，可提供具体需求，我可帮您进一步确认或与供应商对接。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
