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PSA FS55X105K251EGG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FS55X105K251EGG
- Type
- PSA
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FS55X105K251EGG
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 2220
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.54g
- Electronic Component
- 1
- Electronic Component
- BM0264820233
- Electronic Component
- X7R
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FS55X105K251EGG 高压贴片MLCC产品概述
一、产品身份与核心定位
FS55X105K251EGG是信昌电陶（PSA） 旗下的中高压贴片多层陶瓷电容（MLCC），针对需要稳定耐压、中等容值及宽温适应性的电路设计，属于X7R介质系列的典型产品，可满足工业电源、家电控制等场景的批量应用需求。
二、核心性能参数解析
该产品参数与型号标识一一对应，关键指标明确：
- 容值与精度：标称容值1μF（型号中“105”表示10⁵ pF=1μF），精度±10%（“K”为EIA精度代码），满足滤波、耦合场景的常规偏差要求；
- 额定电压：250V直流（型号“251”表示25×10¹ V=250V），适配部分低压AC电路（有效值≤177V）的直流等效耐压；
- 温度系数：X7R介质，符合EIA标准：工作温度-55℃~+125℃，容值变化率≤±15%，温度稳定性优于Y5V等高容值介质；
- 封装尺寸：2220英制封装，对应公制尺寸约5.7mm（长）×5.0mm（宽），厚度通常1.5~2.0mm（依批次略有差异），兼容常规SMT贴装设备。
三、X7R介质的特性优势
采用X7R铁电陶瓷介质，平衡了容值密度、温度稳定性与成本：
- 容值密度高于NPO介质（低容变但容值小），适配1μF级别中等容值需求；
- 宽温范围内容值波动小，避免极端温度下电路性能漂移；
- 无极性设计，贴装无需区分正负极，简化生产流程。
四、封装与工艺可靠性
2220封装的MLCC采用多层陶瓷叠层工艺，PSA针对该产品优化了电极与陶瓷层结合性：
- 贴片式设计，兼容自动化贴装，生产效率高；
- 多层陶瓷结构耐机械应力，抗振动、冲击能力优于电解电容，适合工业振动环境；
- 符合RoHS 2.0、REACH环保标准，无铅无镉，满足全球市场合规要求。
五、典型应用场景
参数特性使其适配以下常见场景：
- 工业电源滤波：AC/DC电源模块高压侧滤波，抑制纹波与EMI干扰；
- 家电控制板：洗衣机、空调等家电高压电路耦合、旁路，稳定信号传输；
- 通信基站电源：小型电源模块储能与滤波，保障信号稳定；
- 小型医疗设备：部分低压医疗设备信号耦合，符合安全耐压要求；
- 汽车电子（需确认批次）：部分汽车低压系统高压兼容电路（车规级需选PSA车规系列）。
六、品牌与质量保障
信昌电陶（PSA）是国内MLCC主流制造商，该产品具备：
- ISO 9001认证，批次一致性好，减少生产参数波动；
- 部分批次通过IATF 16949认证（依批次确认），满足严苛场景；
- 完善技术支持与售后保障，适合企业批量采购。
该产品凭借中高压适配、宽温稳定及高可靠性，成为工业与消费电子领域的实用选型。
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