WMSIC Electronic Components

PSA FN31X104K500PXG

ModelFN31X104K500PXG
Package1206
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FN31X104K500PXG
Type
PSA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FN31X104K500PXG
Electronic Component
1
Electronic Component
100nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.048g
Electronic Component
1
Electronic Component
BM0257411968
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FN31X104K500PXG 产品概述

一、产品简介

FN31X104K500PXG 为 PSA(信昌电陶)旗下通用贴片多层陶瓷电容(MLCC),标称容值 100nF(104)、容差 ±10%(K)、额定电压 50V(500)、介质类型 X7R,常用封装为 1206(公制 3216)。该系列面向常规电源旁路、去耦与滤波场景,具有体积小、无极性、耐温范围广、频率响应好等典型 MLCC 优点。

二、主要电气与温度特性

  • 容值:100nF,公差 ±10%
  • 额定电压:50V DC(注意直流偏置导致的有效电容下降)
  • 介质:X7R(工作温度范围 -55°C 至 +125°C,温度变化下容值变化典型不超过 ±15%)
  • 高频特性:MLCC 本征 ESR/ESL 较低,适用于高频去耦与瞬态响应优化场合。
    温馨提示:X7R 属温介质,稳定性优于 Y5V 但不及 C0G/NP0,精密滤波或参考电路应优先考虑 C0G。

三、机械与封装信息

封装 1206(约 3.2 × 1.6 mm,3216M 公制)适合常规表贴工艺。该尺寸在工艺兼容性与容量/电压折中上较为常用,便于自动贴装与回流焊接。具体焊盘尺寸、厚度与推荐 PCB landpattern 建议参照厂方数据手册以保证焊接可靠性。

四、典型应用

  • 电源去耦与稳压器旁路(DC–DC 输入/输出、LDO)
  • 高频 EMI 滤波与旁路网络
  • 耦合/旁路电容、积分滤波器中的非精密电容元件
  • 工业与消费电子中一般性旁路与去耦需求

五、装配与可靠性注意事项

  • 回流焊:兼容无铅回流工艺,建议遵循 JEDEC 推荐曲线并参考厂方焊接说明。
  • 直流偏置效应:陶瓷介质在接近额定电压时会有显著电容下降,尤其在较小体积/高介电常数材料中更明显;关键电路建议留有裕量或选用更高额定电压规格。
  • 机械应力:贴片电容对 PCB 弯曲和焊接冷却时的机械应力敏感,设计 PCB 与走线时应避免过大应力集中或使用柔性过孔缓冲。
  • 湿热与储存:建议按厂方包装与储存建议操作,贴片器件应避免长期潮湿暴露并在规定时间内回流焊。

六、选型与设计建议

  • 若电路对容值稳定性或温漂有严格要求,优先考虑 C0G/NP0 类型;X7R 适合普通去耦与滤波需求。
  • 对于高压或需保持更高实际容值应用,可选更高额定电压或并联多只器件以减小 DC-bias 影响。
  • 在关键设计中应参考器件的 DC-bias 曲线与频率响应,并在实际 PCB 环境下做样板测试确认性能。

建议在最终定型前索取 PSA 提供的 FN31X104K500PXG 数据手册(含尺寸图、典型 DC-bias 与频率特性、焊接说明)并进行实际电路验证,以确保满足目标应用的电气与可靠性要求。

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