WMSIC Electronic Components

PSA FV43N101J202ECG

ModelFV43N101J202ECG
Package1812
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV43N101J202ECG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV43N101J202ECG
Electronic Component
1
Electronic Component
100pF
Package
1812
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.157g
Electronic Component
1
Electronic Component
BM0264906444
Electronic Component
C0G
Voltage
2kV
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV43N101J202ECG 产品概述

一、产品概况

FV43N101J202ECG 为 PSA(信昌电陶)系列高压多层陶瓷贴片电容(MLCC),规格为 1812 封装,标称电容 100 pF,精度 ±5%(J),额定耐压 2 kV,温度特性为 C0G(亦称 NP0)。该型号针对高电压、低损耗、温度稳定性要求高的精密电路设计而来,适合在要求稳定电容值与高介质强度的场合取代传统高压电容或薄膜电容。

二、主要电气参数

  • 电容值:100 pF(标称)
  • 精度:±5%(J)
  • 额定电压:2000 V DC(2 kV)
  • 温度系数:C0G / NP0(近似 0 ±30 ppm/°C,具有极高的温度稳定性)
  • 封装:1812(约 4.57 mm × 3.05 mm,实际尺寸以厂方数据为准)
  • 材质与损耗:C0G 陶瓷介质,具有极低的介质损耗(低 tanδ)、高 Q 值及极小的电容随频率变化

(注:以上参数为常规描述,具体电气参数如介质损耗、绝缘电阻、自谐振频率及老化系数请以 PSA 官方数据手册为准。)

三、特性与优势

  • 高耐压:2 kV 额定电压使其适用于中高压直流或脉冲场景,单片即可满足较高电压需求,减小器件数量与系统体积。
  • 高稳定性:C0G(NP0)陶瓷介质在温度与频率范围内保持电容值稳定,适合精密滤波、定时及谐振电路。
  • 低损耗、高 Q:适合对相位、损耗敏感的高频及射频场合。
  • 表面贴装(SMD):1812 尺寸便于自动化贴装,焊接可靠,适合批量生产与紧凑 PCB 布局。
  • 机械与介电强度:PSA 品牌在高压 MLCC 制造上具有经验,产品在介电强度与工艺一致性上具有优势(具体可靠性测试结果请参考厂方认证数据)。

四、典型应用场景

  • 高压电源与电源滤波:高压整流、倍压电路中的旁路与滤波元件。
  • 脉冲与高压测量:示波测量、脉冲耦合与分压网络。
  • 精密定时与谐振回路:采用 C0G 的频率稳定电路(振荡器、相位锁定环、滤波器)。
  • 医疗、工业高压装置:需稳定高压电容元件的医疗设备与工业电源。
  • 射频与高频应用:低损耗、低自感特性有利于高频性能优化的场合。

五、封装与安装注意事项

  • PCB 布局:高压器件需保证周围足够的爬电距离与空气间隙,避免表面污染导致击穿或爬电;布局时应考虑电场集中并避免锐角走线直指电极端。
  • 回流焊与应力控制:遵循厂方推荐的回流曲线,避免过热或急冷造成内部裂纹。1812 为相对较大封装,焊接时产生的热机械应力需控制,推荐合理的焊盘尺寸与焊膏量以形成良好焊接支撑。
  • 机械应力:贴片电容对基板弯曲和机械冲击敏感,推荐在高振动或有温度循环的环境下采用合适的应力缓解措施(如加固涂覆、填充或使用支撑结构)。
  • 表面处理与清洁:高压应用对表面污染敏感,焊后应彻底清洁残留物。如环境存在潮气或污染风险,建议使用绝缘涂层或灌封以提升表面耐压与长期可靠性。

六、选型与可靠性建议

  • 降额使用:在安全关键或长期可靠性要求高的系统中,建议对额定电压进行适度降额(依据可靠性需求可在 20%–50% 范围内考虑),以降低局部电场强度与失效风险。
  • 考核指标:在最终选型前,应关注并验证厂方提供的耐压测试、部分放电(PD)、寿命与热循环试验、机械冲击/振动数据以及批次一致性报告。
  • 替代与配合元件:若系统需要更大容量或不同介质特性,应结合温度系数、频率响应与体积进行综合比较;对于高压耦合或滤波场合,可与高压薄膜电容或专用 HV 电容配套使用。

七、总结

FV43N101J202ECG 是一款面向高压与高稳定性场景的 100 pF/±5%/2 kV C0G MLCC,具备高耐压、低损耗、温度与频率稳定等优点。适用于高压电源、脉冲测量、精密谐振与射频场景。在实际应用中,请结合 PCB 设计、焊接工艺与可靠性要求进行合适的降额与防护,必要时参考 PSA 官方技术手册与样片测试数据,以保证长期稳定运行。

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