Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FH12X472K302EGG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- PSA FH12X472K302EGG
- Type
- PSA
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FH12X472K302EGG
- Electronic Component
- 1
- Electronic Component
- 4.7nF
- Package
- 1812
- Electronic Component
- Capacitor
- Electronic Component
- ±10%
- Electronic Component
- 0.326g
- Electronic Component
- 1
- Electronic Component
- BM0264820231
- Operating Temperature
- 55℃~+125℃
- Electronic Component
- X2
- Operating Voltage(AC)
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FH12X472K302EGG 产品概述
一、产品简介
FH12X472K302EGG 为 PSA（信昌电陶）出品的一款安规干膜电容，型号定位为 X2 类跨线路抑制电容。标称容量 4.7nF（472），公差 ±10%（K），适用于市电干扰抑制与 EMI 滤波场合，封装为 SMD 1812（EIA 1812）。
二、主要参数
- 容值：4.7nF（4700pF）
- 公差：±10%（K）
- 额定交流电压：250VAC（X2 类，适合直连市电相与中性线）
- 防护等级：X2（跨线路抑制用）
- 工作温度：-55℃ ~ +125℃
- 封装：1812 SMD（约 4.6mm × 3.0mm）
- 品牌：PSA（信昌电陶）
三、产品特点与优势
- 专为跨线路 EMI/RFI 抑制设计，满足 X2 安规要求，可直连市电相—中线使用；
- 宽温范围与良好热稳定性，适应工业与民用环境；
- SMD 1812 尺寸在功率密集的开关电源与家电主板上布局方便；
- 优化的结构与材料提高耐久性与抗湿性能，降低失效率与漏电风险。
四、典型应用
- 开关电源（SMPS）输入 EMI 滤波；
- 家用电器、电机驱动与照明电源的抑制网络；
- 工业控制与安防设备的电磁兼容（EMC）方案；
- 任何需要跨相—中性线路抑制的电源前端电路。
五、封装、焊接与储存建议
- 兼容常规回流焊工艺（建议峰值温度 ≤ 260℃，遵循 JEDEC 回流曲线）；
- 焊接后建议进行必要的清洗与干燥处理以防潮；
- 储存于干燥、防尘环境，避免长期高温高湿以延长寿命。
六、使用注意事项与可靠性
- X2 电容适用于相—中性（相对地）线路，不可替代 Y 类（线对地）安全电容；
- 设计时应考虑电压裕量与浪涌抑制，必要时与阻尼元件或熔断保护配合使用；
- 推荐遵循相关安规标准（如 IEC 60384-14 等）进行选型与认证验证。
如需器件数据手册、阻抗/DF 曲线或样品测试报告，可提供进一步支持与资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
