WMSIC Electronic Components

PSA FS55X105K631EHG

ModelFS55X105K631EHG
Package2220
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FS55X105K631EHG
Type
PSA
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FS55X105K631EHG
Electronic Component
1
Electronic Component
1uF
Package
2220
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.57g
Electronic Component
1
Electronic Component
BM0257411962
Electronic Component
X7R
Voltage
630V
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FS55X105K631EHG 产品概述

一、概述

FS55X105K631EHG 是 PSA(信昌电陶)出品的一款高压贴片多层陶瓷电容(MLCC),规格为 1µF,容差 ±10%,额定直流电压 630V,温度特性 X7R,封装代号 2220(大致尺寸约 5.7 × 5.0 mm)。该器件适用于对体积、可靠性及高压耐受有要求的电力电子与工业应用场景。

二、主要电气参数

  • 标称电容:1.0 µF
  • 容差:±10%(在参考温度与无偏压条件下)
  • 额定电压:630 VDC
  • 温度系数:X7R(-55℃ 至 +125℃ 范围内电容变化在 ±15% 以内)
  • 封装:2220(SMD)
  • 介质特性:Class II 陶瓷,适合中等电容量密度与温度稳定性的平衡需求

三、性能特点与注意事项

  • 高频响应好、等效串联电阻(ESR)和等效串联电感(ESL)低,适用于高频旁路与滤波场合。
  • 630V 额定使其可用于中高压直流链路(DC-link)、逆变器、开关电源与脉冲抑制等。
  • 需特别注意直流偏置效应:X7R 类 MLCC 在施加高电压时电容值会显著下降,实际工作电压下的有效电容应通过厂方曲线或实测数据评估并留有裕量。
  • MLCC 的老化特性:Class II 材料随时间会有对数型衰减,设计时应考虑初始余量或采取退火处理以稳定电容值。
  • 封装尺寸较大,焊接时按厂家推荐回流温度曲线进行,避免热应力导致损伤。

四、典型应用

  • 中高压直流母线(DC-link)与功率转换器滤波
  • 逆变器、太阳能并网、充电桩和电机驱动等电力电子设备
  • 高压开关电源、浪涌抑制与能量吸收电路
  • 高频去耦与稳定电路,结合小尺寸并联使用以兼顾低频与高频性能

五、设计建议

  • 在高电压应用中,按额定工作电压选型并考虑直流偏置导致的电容下降,必要时并联多只以满足电容量和滤波要求。
  • 遵循厂方的焊接与储存规范,避免长时间高温或潮湿环境以降低失效风险。
  • 在关键应用场合建议参考 PSA 提供的电容随偏置、电压与温度的特性曲线,进行样品评估与工程验证。

FS55X105K631EHG 以其高压等级与较大电容量,为中高压电源与功率电子系统提供了体积紧凑、响应快速的电容解决方案。若需具体偏置曲线、封装尺寸图或可靠性数据,可向供应商索取详细技术资料。

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