Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FN18X103K500PSG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FN18X103K500PSG
- Type
- PSA
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FN18X103K500PSG
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0257411986
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FN18X103K500PSG 产品概述
一、主要规格
- 型号：FN18X103K500PSG（PSA / 信昌电陶）
- 容值：10 nF（103）
- 容差：±10%（K）
- 额定电压：50 V DC（500）
- 温度特性：X7R（-55°C 至 +125°C，最大电容变化 ±15%）
- 封装：0603（1608 公制）表面贴装陶瓷多层电容（MLCC）
二、性能特点
- 高频性能良好：多层陶瓷结构带来较低等效串联电感（ESL），适合去耦和滤波应用。
- 温度稳定性：X7R 介质在宽温度范围内保持相对稳定电容值，适合多数通用电子产品。
- 电压系数与线性：陶瓷介质存在电压依赖性，在高场强下电容可能下降，设计时建议考虑必要的裕量或采取降额策略。
- 可靠性与寿命：无极性、耐振动，适合自动贴装工艺；在正常应力范围内具有长期稳定性。
三、典型应用
- 电源去耦：为数字、模拟电路的电源轨提供高频旁路与瞬态电流支持。
- 高频滤波：用于射频前端、时钟电路和高速接口的滤波与阻抗整合。
- 通信设备、消费电子、工业控制、仪器仪表等要求体积小、性能稳的场合。
四、使用与注意事项
- 降额使用：建议在关键应用中按额定电压的50%~80%选择或增加容值余量，以抵消电压系数导致的实际电容下降。
- 温度环境：虽然 X7R 在-55°C~+125°C 范围内性能稳定，但极端温度、频繁热循环会影响长期老化特性。
- 焊接工艺：推荐符合回流焊温度曲线的工艺规范，避免过高峰值温度和长时间保温以减少裂纹风险。
- 机械应力：贴片在 PCB 弯曲或热循环中可能出现微裂，应在布局时避免直接受力并使用合适的焊盘设计。
五、包装与替代建议
- 包装形式：常见为卷带（Tape & Reel），适用于高速贴片机。
- 替代型号：同等容值/电压/X7R/0603 的通用 MLCC 可作为替代，但需比对尺寸、焊盘推荐、高频特性与可靠性认证。
- 选型提示：若需更稳定电容随电压变化，考虑 C0G/NP0 系列；若更大容值或更高电压，选择相应封装与材料等级。
综上，FN18X103K500PSG 是一款适用于通用去耦与滤波场景的 0603 封装 X7R MLCC。在设计时关注电压系数与焊接、机械应力管理，可获得良好的电气与机械可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
