WMSIC Electronic Components

PSA FN18X104K500PBG

ModelFN18X104K500PBG
Package0603
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FN18X104K500PBG
Type
PSA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FN18X104K500PBG
Electronic Component
1
Electronic Component
100nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0257411964
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FN18X104K500PBG 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本定位与品牌背景

FN18X104K500PBG是PSA信昌电陶推出的通用型贴片多层陶瓷电容(MLCC),属于该品牌常规工业级/消费电子级系列产品。信昌电陶作为国内专业MLCC制造商,专注陶瓷电容研发生产十余年,产品覆盖通用、高压、高频等领域,FN18系列以高性价比、稳定一致性为核心特点,适配中低端电子设备的基础电路需求。

二、核心性能参数详解

该产品关键参数直接决定应用场景,具体如下:

  1. 容值与精度:标称容值100nF(代码“104”,即10×10⁴pF),精度±10%(代码“K”),满足大多数滤波、耦合电路的误差要求;
  2. 额定电压:50V直流额定电压,适配低压至中压(≤40V实际工作电压)电路,避免过压击穿;
  3. 温度系数:X7R特性,工作温度范围-55℃~+125℃,容值变化率≤±15%。相比Y5V(温变窄、容变±20%)更稳定,相比NP0(高精度但成本高)更具性价比,平衡性能与成本;
  4. 环保合规:符合RoHS 2.0、REACH标准,无铅端电极设计,适配绿色制造需求。

三、封装规格与物理特性

产品采用0603封装(英制命名,公制尺寸1.6mm×0.8mm),是小型化设备主流封装,物理特性:

  • 尺寸:长1.6±0.15mm,宽0.8±0.15mm,厚度≤0.8mm(典型值0.5mm);
  • 端电极:镍(Ni)底层+锡(Sn)表层镀层,焊接兼容性强,支持回流焊、波峰焊,焊点可靠性高;
  • 机械强度:抗振动性能满足GJB 150-2009(工业级)要求,适配车载、工业控制等振动环境。

四、典型应用场景

因参数均衡,广泛应用于以下领域:

  1. 消费电子:手机、平板、智能穿戴的电源滤波(滤除纹波)、信号耦合(音频/射频路径);
  2. 工业控制:PLC、传感器模块的信号调理(稳定电压)、电源滤波;
  3. 汽车电子:车载辅助系统(倒车雷达、中控屏)低压电路滤波,X7R温变适配车载环境(-40℃~+85℃);
  4. 通信设备:路由器、交换机电源模块滤波,抑制电磁干扰(EMI);
  5. 小家电:充电器、遥控器、智能家电的DC-DC转换滤波。

五、品牌与品质优势

PSA信昌电陶对该产品的管控优势:

  1. 产能稳定:自动化生产线月产能千万级,满足批量订单;
  2. 一致性管控:容值、电压、温度特性离散度≤5%,避免批量波动;
  3. 可靠性测试:通过125℃×1000h高温存储、-55℃~+125℃×500次温循、85℃/85%RH×1000h耐湿试验,符合IEC 60384-14标准;
  4. 抗硫化性能:端电极镀层优化,抵御工业硫化气体侵蚀,延长寿命。

六、选型与使用注意事项

  1. 电压降额:建议实际电压≤40V(额定80%),避免长期过压导致容值衰减;
  2. 温度范围:需在-55℃~+125℃内使用,超出则容变超限;
  3. 替代参考:可替代村田GRM188R61C104KA31D、三星CL0603CRNPO9BN104,需确认封装/端电极兼容性;
  4. 焊接工艺:回流焊温度曲线符合IPC-J-STD-020,避免高温损坏陶瓷介质。

该产品凭借均衡参数与可靠品质,成为电子设备基础电路的高性价比选择。

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