WMSIC Electronic Components

PSA FE2HX475M251LGL

ModelFE2HX475M251LGL
Package2220
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FE2HX475M251LGL
Type
PSA
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FE2HX475M251LGL
Electronic Component
1
Electronic Component
4.7uF
Package
2220
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
1.71g
Electronic Component
1
Electronic Component
BM0264820200
Electronic Component
X7R
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FE2HX475M251LGL 贴片陶瓷电容(MLCC)产品概述

FE2HX475M251LGL是PSA信昌电陶推出的一款高压贴片多层陶瓷电容(MLCC),专为中高压电路的滤波、耦合、去耦等场景设计,兼顾容值稳定性与宽温适应性,是工业电源、照明驱动等领域的可靠选型。

一、产品核心身份与定位

该型号属于PSA信昌电陶的高压MLCC产品线,聚焦250V额定电压+4.7μF中高容值的应用缺口,采用X7R介质材料保证温度稳定性,2220贴片封装适配SMT自动化生产,可满足高密度PCB设计的紧凑空间需求。

二、关键电气性能参数解析

参数项 规格值 意义说明 标称容值 4.7μF 型号中“475”标识(47×10⁵ pF=4.7μF),中高容值适合滤波等大容需求 容值精度 ±20%(M级) 符合EIA商业级精度,兼顾成本与性能平衡,满足多数工业/消费电子场景 额定电压(VR) 250V 工作电压上限,稳定承受250V直流/交流峰值,适配高压电路设计 温度系数 X7R 核心介质特性,-55℃~+125℃内电容变化率≤±15%,宽温稳定性优异

三、封装与物理特性

FE2HX475M251LGL采用2220英制贴片封装(公制尺寸约2.2mm×2.0mm),具备以下特点:

  1. 贴片式设计:支持SMT贴装工艺,适配自动化生产线,生产效率高;
  2. 紧凑体积:2220封装在高压MLCC中属于小尺寸范畴,有效节省PCB空间;
  3. 端电极优化:镍/锡镀层端电极,焊接兼容性好,可通过回流焊、波峰焊实现可靠连接。

四、X7R介质的材料优势

X7R是MLCC常用铁电陶瓷介质,区别于Y5V(温漂大、容值高)、NPO(温漂极小、容值低),该型号X7R介质具备三大核心优势:

  • 宽温适应性:工作温度覆盖-55℃至+125℃,满足工业环境(户外设备、高温车间)的温度波动需求;
  • 容值稳定性:温度变化时电容波动≤±15%,避免滤波效果下降、耦合信号失真;
  • 耐电压性能:配合250V额定电压,高压场景下长期稳定,不易介质击穿。

五、典型应用场景

结合参数特性,该型号主要适用于:

  1. 工业开关电源:高压侧滤波(AC-DC转换后母线滤波),4.7μF抑制纹波,X7R适配工业温度变化;
  2. LED驱动电源:高压输出滤波(升压电路后),250V满足LED驱动高压需求,稳定输出;
  3. 消费电子高压模块:如旧CRT显示器高压耦合、充电器高压滤波,兼顾成本与性能;
  4. 通信设备电源:基站/路由器电源高压去耦,2220封装适配高密度设计。

六、可靠性与品质保障

PSA信昌电陶对该型号通过多项可靠性测试:

  • 高温寿命测试:125℃、250V下1000小时,容值变化率≤±10%,满足工业级寿命;
  • 湿度耐久性测试:85℃/85%RH下500小时,绝缘电阻≥10⁹Ω,防止潮气侵入;
  • 标准 compliance:符合EIA-198、IEC 60384-14等国际标准,品质可控。

七、选型参考注意事项

  1. 电压安全:实际工作电压不超250V,避免瞬态过压导致容值下降或击穿;
  2. 温度匹配:环境温度超出-55℃~+125℃时,需更换X8R等其他温度系数介质;
  3. 封装适配:PCB焊盘尺寸需匹配2220封装,避免焊接缺陷。

总结:FE2HX475M251LGL凭借“250V高压+4.7μF中高容值+X7R宽温稳定”的核心特性,成为工业电源、照明驱动等领域的高性价比选型,适配SMT自动化生产与高密度PCB设计,可靠性经PSA严格验证。

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