WMSIC Electronic Components

PSA FV43X102K302EFG

ModelFV43X102K302EFG
Package1812
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV43X102K302EFG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV43X102K302EFG
Electronic Component
1
Electronic Component
1nF
Package
1812
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.232g
Electronic Component
1
Electronic Component
BM0257411970
Electronic Component
X7R
Voltage
3kV
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV43X102K302EFG 产品概述

一、产品简介

FV43X102K302EFG 为 PSA(信昌电陶)系列高压多层陶瓷贴片电容(MLCC),标称容值 1nF(102)、容差 ±10%、额定直流电压 3kV、温度特性 X7R,封装规格为 1812(约 4.6 × 3.2 mm)。该型号为无极性器件,适用于需要中等容值与高电压耐受性的电路场合。

二、主要特性

  • 额定电压:3 kV DC,高压工况下可靠性设计;
  • 容值:1 nF,±10% 公差,适合高压耦合与滤波;
  • 温度系数:X7R,工作温度范围广(典型 -55°C 至 +125°C),介电常数相对稳定;
  • 封装:1812 SMD,适合自动贴装与回流焊工艺;
  • 结构:多层陶瓷,低漏电、高绝缘强度。

三、典型应用场景

  • 高压电源滤波、旁路;
  • 脉冲电路与高压耦合/去耦;
  • 高压探测/分压器前端滤波;
  • 医疗设备、高压驱动板、工业高压电源与检测模块。

四、性能与使用注意

  • X7R 材料在高直流偏置下会出现显著电容衰减,使用前需评估在 3 kV 工况下的实际剩余容值;
  • 建议在接近额定电压环境中进行适度降额与验证(基于可靠性需求可考虑 50%–80% 降额原则);
  • 高压电路设计应确保器件周围有足够的爬电与间隙距离,并采取绝缘涂覆或加强绝缘措施以防表面击穿;
  • 器件为无极性,但请避免机械应力、弯曲或强振动导致裂纹。

五、封装与安装建议

  • 1812 尺寸适配常见 PCB 布局,推荐留有管脚焊盘与足够的焊膏量以保证焊接强度;
  • 回流焊温度曲线应遵循厂家推荐的焊接规范,避免过骤的热冲击;
  • 焊接后避免强烈机械应力,贴片电容对压敏感,手工装配或波峰焊不建议用于此类高压 MLCC。

六、检验与可靠性测试

  • 推荐对成品进行耐压测试(DC 耐压/泄漏电流)、绝缘电阻、以及在目标温度/湿度下的老化测试;
  • 对长期储存或开盘后的卷带,若怀疑受潮,应按厂家建议进行回流前烘烤以避免焊接缺陷;
  • 在关键应用建议索取并参照 PSA 的详细数据表与可靠性试验报告。

七、选型与采购建议

  • 订购时请核对完整料号与包装形式(卷带/盘件)、批次及检验报告;
  • 若电容随 DC 偏置或温漂敏感影响系统性能,可考虑更稳定介质(如 C0G/NP0)或调整器件并联/串联方式以满足电压与容值需求;
  • 在高可靠性或安规相关场合,建议与 PSA 技术支持确认具体应用条件下的资格与测试要求。

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